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・The use of Nickel(Ni) as material for both the internal and external electrodes improves the solderability and heat resistance characteristics. This almost completely eliminates migration and raises the level of reliability significan
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・Low equivalent series resistance(ESR) provides excellent noise absorption characteristic
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・Compared to tantalum or aluminum electrolytic capacitors these ceramic capacitors offer a number of excellent features, including:Higher permissible ripple current values Smaller case sizes relative to rated voltage Improved reliability due to higher insulation resistance and breakdown voltage.
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| CATALOG |
GMK325F106ZH-T COUNTRY OF ORIGIN
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GMK325F106ZH-T LIFECYCLE
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GMK325F106ZH-T PARAMETRIC INFO
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GMK325F106ZH-T PACKAGE INFO
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GMK325F106ZH-T MANUFACTURING INFO
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GMK325F106ZH-T PACKAGING INFO
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GMK325F106ZH-T APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Japan
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LIFECYCLE
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Obsolete
Jan 31,2018
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PARAMETRIC INFO
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| Capacitance Value |
10uF |
| Voltage |
35VDC |
| Tolerance |
-20% to 80% |
| Dielectric |
Y5V |
| Technology |
Standard |
| Maximum Operating Temperature (°C) |
85 |
| Case Style |
Ceramic Chip |
| Construction |
Flat |
| Microwave Application |
No |
| Operating Temperature (°C) |
-30 to 85 |
| Minimum Operating Temperature (°C) |
-30 |
| Equivalent Series Resistance Type |
Low |
| DC Rated Voltage (VDC) |
35 |
| Negative Capacitance Tolerance (%) |
-20 |
| Positive Capacitance Tolerance (%) |
80 |
| Maximum Storage Temperature (°C) |
30 |
| Maximum Dissipation Factor (%) |
7 |
| Polarity |
Non Polar |
| Fixed/Variable |
Fixed |
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PACKAGE INFO
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| Package/Case |
1210 |
| Mounting |
Surface Mount |
| Termination Style |
Pad |
| Terminal Pitch (mm) |
N/R |
| Product Length (mm) |
3.2 |
| Product Depth (mm) |
2.5 |
| Product Height (mm) |
1.5 |
| Product Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
N/R |
| Product Weight (g) |
N/A |
| Number of Terminals |
2 |
| Size (mm) |
3.2 X 2.5 X 1.5 |
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MANUFACTURING INFO
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| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
2 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
T |
| Packaging |
Tape and Reel |
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APPLICATIONS
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・General digital circuit
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・Power supply bypass capacitors Liquid crystal modules Liquid crystal drive voltage lines LS I, I C, converters(both for input and output)
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・Smoothing capacitors DC-DC converters (both for input and output) Switching power supplies (secondary side)
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