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• Low profile package
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• Ideal for automated placement
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• Glass passivated chip junction
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• High forward surge capability
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• Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
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| CATALOG |
GS1G PARAMETRIC INFO
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GS1G PACKAGE INFO
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GS1G PACKAGING INFO
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GS1G APPLICATIONS
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PARAMETRIC INFO
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| Configuration |
Single |
| Peak Reverse Repetitive Voltage (V) |
400 |
| Maximum Continuous Forward Current (A) |
1 |
| Maximum Forward Voltage (V) |
1.1 |
| Peak Non-Repetitive Forward Surge Current (A) |
60 |
| Peak Reverse Current (uA) |
5 |
| Operating Junction Temperature (°C) |
-55 to 150 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
SMA |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
2 |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
4.75(Max) |
| Package Width (mm) |
2.83(Max) |
| Package Height (mm) |
2.1(Max) |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Weight (g) |
0.059 |
| Package Material |
Plastic |
| Package Description |
SMD Plastic Package |
| Package Family Name |
DO |
| Jedec |
DO-214AC |
| Package Outline |
Link to Datasheet |
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PACKAGING INFO
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| Packaging Document |
Link to Datasheet |
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APPLICATIONS
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For use in general purpose rectification of power supplies,
inverters, converters, and freewheeling diodes for consumer
and telecommunication.
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