HCF4081BEY STMicroelectronics IC GATE AND 4CH 2-INP 14DIP

label:
2024/10/29 155
HCF4081BEY STMicroelectronics 	IC GATE AND 4CH 2-INP 14DIP


• MEDIUM SPEED OPERATION: tPD = 60ns (Typ.) at 10V
• QUIESCENT CURRENT SPECIFIED UP TO 20V
• 5V, 10V AND 15V PARAMETRIC RATINGS
• INPUT LEAKAGE CURRENT II = 100nA (MAX) AT VDD = 18V TA = 25°C
• 100% TESTED FOR QUIESCENT CURRENT


CATALOG
HCF4081BEY COUNTRY OF ORIGIN
HCF4081BEY PARAMETRIC INFO
HCF4081BEY PACKAGE INFO
HCF4081BEY MANUFACTURING INFO
HCF4081BEY PACKAGING INFO
HCF4081BEY ECAD MODELS


COUNTRY OF ORIGIN
China


PARAMETRIC INFO
Logic Family 4000B
Logic Function AND
Number of Element Inputs 2-IN
Number of Element Outputs 1
Number of Elements per Chip 4
Number of Output Enables per Element 0
Number of Selection Inputs per Element 0
Process Technology CMOS
Minimum Operating Supply Voltage (V) 3
Maximum Operating Supply Voltage (V) 20
Typical Operating Supply Voltage (V) 3.3|5|9|12|15|18
Maximum High Level Output Current (mA) -2.4(Min)
Maximum Low Level Output Current (mA) 2.4(Min)
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 125
Maximum Propagation Delay Time @ Maximum CL (ns) 250@5V|125@10V|90@15V
Absolute Propagation Delay Time (ns) 250
Propagation Delay Test Condition (pF) 50
Maximum Quiescent Current (uA) 5
Typical Quiescent Current (uA) 0.02


PACKAGE INFO
Supplier Package PDIP
Basic Package Type Through Hole
Pin Count 14
Lead Shape Through Hole
PCB 14
Tab N/R
Pin Pitch (mm) 2.54
Package Length (mm) 20(Max)
Package Width (mm) 7.1(Max)
Package Height (mm) 5.1(Max) - 0.51(Min)
Package Diameter (mm) N/R
Seated Plane Height (mm) 5.1(Max)
Mounting Through Hole
Package Material Plastic
Package Description Plastic Dual In Line Package
Package Family Name DIP
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/R
Maximum Reflow Temperature (°C) N/A
Reflow Solder Time (Sec) N/A
Number of Reflow Cycle N/A
Standard IPC-1752
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 260
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
Shelf Life Period 2 Years
Number of Wave Cycles 2


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 25
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ