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• 15 kV/µs minimum Common Mode Rejection (CMR) at VCM= 1 kV for HCNW2611, HCPL-2611, HCPL-4661,HCPL-0611, HCPL-0661
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• High speed: 10 MBd typical
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• LSTTL/TTL compatible
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• Low input current capability: 5 mA
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• Available in 8-Pin DIP, SOIC-8, widebody packages
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| CATALOG |
HCPL-2630-500E COUNTRY OF ORIGIN
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HCPL-2630-500E PARAMETRIC INFO
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HCPL-2630-500E PACKAGE INFO
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HCPL-2630-500E MANUFACTURING INFO
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HCPL-2630-500E PACKAGING INFO
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HCPL-2630-500E ECAD MODELS
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HCPL-2630-500E APPLICATIONS
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COUNTRY OF ORIGIN
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Thailand
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PARAMETRIC INFO
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| Input Type |
DC |
| Output Type |
Open Collector |
| Polarity |
Inverting |
| Direction Type |
Uni-Directional |
| Standard |
CSA|UL |
| Logic Gate Type |
Inverter |
| Number of Channels per Chip |
2 |
| Maximum Data Rate |
10MBd(Typ) |
| Minimum Forward Voltage (V) |
1.4 |
| Maximum Working Insulation Voltage (V) |
567 |
| Maximum Propagation Delay Time (tPLH) (ns) |
75 |
| Maximum Propagation Delay Time (tPHL) (ns) |
75 |
| Common Mode Voltage (V) |
1000 |
| Minimum Common Mode Rejection (kV/us) |
5 |
| Maximum Pulse Width Distortion (ns) |
35 |
| Maximum Propagation Delay Skew (ns) |
40 |
| Typical Forward Voltage (V) |
1.5 |
| Maximum Forward Voltage (V) |
1.75 |
| Maximum Forward Current (mA) |
15 |
| Maximum Reverse Voltage (V) |
5 |
| Maximum Continuous Output Current (mA) |
50 |
| Maximum Power Dissipation (mW) |
60 |
| Minimum Isolation Voltage (Vrms) |
3750 |
| Typical Rise Time (us) |
0.024 |
| Typical Fall Time (us) |
0.01 |
| Maximum Propagation Delay Time (ns) |
75 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Supplier Temperature Grade |
Industrial |
| Minimum Supply Voltage (V) |
4.5 |
| Maximum Supply Voltage (V) |
5.5 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
125 |
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PACKAGE INFO
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| Supplier Package |
PDIP SMD |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
9.65 |
| Package Width (mm) |
6.35 |
| Package Height (mm) |
3.56 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
4.2 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Surface Mount Plastic Dual In Line Package |
| Package Family Name |
DIP |
| Jedec |
MS-001BA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
15 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| ECAD MODELS |
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| APPLICATIONS |
| • Isolated line receiver |
| • Computer-peripheral interfaces |
| • Microprocessor system interfaces |
| • Digital isolation for A/D, D/A conversion |
| • Switching power supply |
| • Instrument input/output isolation |
| • Ground loop elimination |
| • Pulse transformer replacement |
| • Power transistor isolation in motor drives |
| • Isolation of high speed logic systems |
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