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• RoHS compliant
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• Low-cost fiber-optic components
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• Enhanced digital links: DC to 5 Mbaud
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• Extended distance links up to 120m at 40 Kbaud
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• Low-current link: 6-mA peak supply current
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|
| CATALOG |
HFBR-2522Z COUNTRY OF ORIGIN
|
HFBR-2522Z PARAMETRIC INFO
|
HFBR-2522Z PACKAGE INFO
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HFBR-2522Z MANUFACTURING INFO
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HFBR-2522Z PACKAGING INFO
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HFBR-2522Z ECAD MODELS
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HFBR-2522Z APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Thailand
|
|
PARAMETRIC INFO
|
| Type |
RX |
| Maximum Data Rate |
1MBd |
| Emitter Type |
LED |
| Connector Type |
Versatile-Link |
| Peak Wavelength (nm) |
600 |
| Maximum Power Dissipation (mW) |
40 |
| Maximum Output Current (mA) |
25 |
| Minimum Operating Supply Voltage (V) |
-0.5 |
| Typical Operating Supply Voltage (V) |
1.8|2.5|3.3|5 |
| Maximum Operating Supply Voltage (V) |
7 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Distance (m) |
55 |
| Operating Supply Voltage (V) |
-0.5 to 7 |
| Maximum Storage Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-40 |
|
|
PACKAGE INFO
|
| Supplier Package |
N/A |
| Basic Package Type |
Through Hole |
| Pin Count |
6 |
| PCB |
6 |
| Tab |
N/R |
| Package Length (mm) |
18.8 |
| Package Width (mm) |
12.2 |
| Package Height (mm) |
7.6 |
| Package Diameter (mm) |
N/R |
| Mounting |
Through Hole |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
N/A |
| Package Family Name |
N/A |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
|
|
PACKAGING INFO
|
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
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| APPLICATIONS |
| • Reduction of lightning/voltage transient susceptibility |
| • Motor controller triggering |
| • Data communications and local area networks |
| • Electromagnetic compatibility (EMC) for regulated systems such as FCC, VDE, and CSA |
| • Tempest-secure data processing equipment |
| |
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