|
|
• High Logging Range: 67 dB (-62 to +5 dBm)
|
• Output Frequency Flatness: ±2 dB
|
• Log Linearity: ±2 dB
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• Fast Rise/Fall Times: 5/15 ns
|
• Single Positive Supply: +3.3V
|
• ESD Sensitivity (HBM): Class 1A
|
• 24 Lead 4x4mm SMT Package: 16mm2
|
|
| CATALOG |
HMC1013LP4ETR COUNTRY OF ORIGIN
|
HMC1013LP4ETR PARAMETRIC INFO
|
HMC1013LP4ETR PACKAGE INFO
|
HMC1013LP4ETR MANUFACTURING INFO
|
HMC1013LP4ETR PACKAGING INFO
|
HMC1013LP4ETR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Korea (Republic of)
|
Malaysia
|
|
PARAMETRIC INFO
|
| Category |
Successive Detection Log Video Amplifier |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
0.9 |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220VGGD-8 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Packaging Document |
Link to Datasheet |
|
|
APPLICATIONS
|
| • EW, ELINT & IFM Receivers |
| • DF Radar Systems |
| • ECM Systems |
| • Broadband Test & Measurement |
| • Power Measurement & Control Circuits |
| • Military & Space Applications |
| |
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