|
|
• Conversion loss: 7 dB
|
• LO to RF and IF isolation: 40 dB
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• Input IP3: 17 dBm
|
• RoHS compliant, 24-terminal, 4 mm × 4 mm LCC package
|
|
| CATALOG |
HMC129ALC4TR COUNTRY OF ORIGIN
|
HMC129ALC4TR PARAMETRIC INFO
|
HMC129ALC4TR PACKAGE INFO
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HMC129ALC4TR MANUFACTURING INFO
|
HMC129ALC4TR PACKAGING INFO
|
HMC129ALC4TR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
United States of America
|
|
PARAMETRIC INFO
|
| Maximum Input Frequency (MHz) |
8000 |
| Maximum Output Frequency (MHz) |
3000 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Input Frequency (MHz) |
4000 |
| Minimum Output Frequency (MHz) |
0 |
| Maximum Conversion Loss (dB) |
9 |
| Maximum Power Dissipation (mW) |
450 |
| Typical Third Order Input Intercept Point (dBm) |
17 |
| Typical LO/RF Isolation (dB) |
40 |
| Typical Noise Figure (dB) |
7 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
CLLCC EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3.9 |
| Package Width (mm) |
3.9 |
| Package Height (mm) |
0.9 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
1.02(Max) |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.3|0.32 |
| Package Weight (g) |
N/A |
| Package Material |
Ceramic |
| Package Description |
Ceramic Leadless Chip Carrier |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
100 |
|
|
| APPLICATIONS |
| • Microwave and very small aperture terminal (VSAT) radios |
| • Test equipment |
| • Military electronic warfare (EW); electronic countermeasure(ECM); and command, control, communications and intelligence (C3I) |
| |
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