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• Ultra Small Package: MSOP8
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• High Isolation: 50 dB
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• Positive Control: 0/+3V to 0/+7V
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| CATALOG |
HMC194AMS8ETR COUNTRY OF ORIGIN
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HMC194AMS8ETR PARAMETRIC INFO
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HMC194AMS8ETR PACKAGE INFO
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HMC194AMS8ETR MANUFACTURING INFO
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HMC194AMS8ETR PACKAGING INFO
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HMC194AMS8ETR ECAD MODELS
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HMC194AMS8ETR APPLICATIONS
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COUNTRY OF ORIGIN
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Switch Type |
SPDT |
| Number of Switches |
1 |
| Switch Configuration |
Single SPDT |
| Frequency Band (MHz) |
0 to 3000 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Insertion Loss (dB) |
1.1 |
| Maximum Frequency (MHz) |
3000 |
| Technology |
GaAs MMIC |
| Switching Speed (ns) |
0.000003(Typ) |
| Minimum Isolation Voltage (dB) |
24 |
| Typical Input 1dB Compressed Power (dBm) |
28 |
| Maximum Power Dissipation (mW) |
300 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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|
PACKAGE INFO
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| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187 |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
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ECAD MODELS
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APPLICATIONS
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• Cellular/PCS Base Stations
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| • Portable Wireless |
| • MMDS & WirelessLAN |
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