|
|
• Ultra Small Package: MSOP8
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• Conversion Loss: 8.5 dB
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• LO / RF Isolation: 25 dB
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|
| CATALOG |
HMC219AMS8 COUNTRY OF ORIGIN
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HMC219AMS8 PARAMETRIC INFO
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HMC219AMS8 PACKAGE INFO
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HMC219AMS8 MANUFACTURING INFO
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HMC219AMS8 PACKAGING INFO
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HMC219AMS8 APPLICATIONS
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COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
|
PARAMETRIC INFO
|
| Maximum Input Frequency (MHz) |
9000 |
| Maximum Output Frequency (MHz) |
2500 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Process Technology |
GaAs MMIC |
| Minimum Input Frequency (MHz) |
4500 |
| Minimum Output Frequency (MHz) |
0 |
| Maximum Conversion Loss (dB) |
10 |
| Typical Third Order Input Intercept Point (dBm) |
21 |
| Typical LO/RF Isolation (dB) |
25 |
| Typical Noise Figure (dB) |
8.5 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
MSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
240 |
| Reflow Solder Time (Sec) |
N/A |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
SnPb |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
50 |
| Packaging Document |
Link to Datasheet |
|
|
APPLICATIONS
|
• UNII & HiperLAN
|
• ISM
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• Microwave Radios
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