 |
|
| • High Isolation: >45 dB |
| • Positive control: 0/+5V |
| • Non-Reflective Design |
| • Ultra Small Package: MSOP8G |
| |
| |
| CATALOG |
| HMC284AMS8GETR COUNTRY OF ORIGIN |
| HMC284AMS8GETR PARAMETRIC INFO |
| HMC284AMS8GETR PACKAGE INFO |
| HMC284AMS8GETR MANUFACTURING INFO |
| HMC284AMS8GETR PACKAGING INFO |
| HMC284AMS8GETR ECAD MODELS |
| HMC284AMS8GETR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Malaysia |
| Taiwan (Province of China) |
|
| PARAMETRIC INFO |
| Switch Type |
SPDT |
| Number of Switches |
1 |
| Switch Configuration |
Single SPDT |
| Frequency Band (MHz) |
0 to 3500 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Insertion Loss (dB) |
1.1 |
| Maximum Frequency (MHz) |
3500 |
| Technology |
CMOS |
| Switching Speed (ns) |
5(Typ) |
| High Control Voltage (V) |
-0.5 to 7.5 |
| Minimum Isolation Voltage (dB) |
30 |
| Typical Input 1dB Compressed Power (dBm) |
30 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
| |
| PACKAGE INFO |
| Supplier Package |
MSOP EP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Micro Small Outline Package, Exposed Pad |
| Package Family Name |
SOP |
| Jedec |
N/A |
|
| |
| MANUFACTURING INFO |
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Cellular/PCS Base Stations |
| • 2.4 GHz ISM |
| • 3.5 GHz Wireless Local Loop |
|
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