HMC311ST89ETR Analog Devices IC RF AMP GP 0HZ-6GHZ SOT89

label:
2025/09/9 6
HMC311ST89ETR Analog Devices  IC RF AMP GP 0HZ-6GHZ SOT89

CATALOG
HMC311ST89ETR COUNTRY OF ORIGIN
HMC311ST89ETR PARAMETRIC INFO
HMC311ST89ETR PACKAGE INFO
HMC311ST89ETR MANUFACTURING INFO
HMC311ST89ETR PACKAGING INFO
HMC311ST89ETR ECAD MODELS


COUNTRY OF ORIGIN
Philippines


PARAMETRIC INFO
Manufacturer Type MMIC Amplifier
Number of Channels per Chip 1
Typical Power Gain (dB) 14.5@6000MHz
Typical Noise Figure (dB) 5@6000MHz
Typical Output 1dB Compressed Power @ Bias Conditions (dBm) 13
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm) 24
Typical Output Intercept Point (dBm) 24@6000MHz
Maximum Reverse Isolation (dB) 20(Typ)@6000MHz
Maximum Power Dissipation (mW) 340
Maximum Operating Frequency (MHz) 6000
Typical Output Power (dBm) 13@6000MHz
Typical Output Power Range (dBm) 10 to 15
Maximum Input Return Loss (dB) 8(Typ)@6000MHz
Maximum Output Return Loss (dB) 8(Typ)@6000MHz
Power Supply Type Single
Maximum Single Supply Voltage (V) 7
Maximum Operating Supply Voltage (V) 7
Maximum Supply Current (mA) 74@5V
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85


PACKAGE INFO
Supplier Package SOT-89
Pin Count 4
PCB 3
Tab Tab
Package Length (mm) 4.6(Max)
Package Width (mm) 2.59(Max)
Package Height (mm) 1.6(Max)
Package Diameter (mm) N/R
Mounting Surface Mount
Package Material Plastic
Package Family Name SOT
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material Ag
Terminal Base Material Cu


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 500
Reel Diameter (in) 13
Packaging Document Link to Datasheet


ECAD MODELS


Продукт RFQ