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• 0.5 dB LSB Steps to 31.5 dB
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• Single Control Line Per Bit
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• ± 0.5 dB Typical Bit Error
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• 9mm
2
Leadless SMT Plastic Package
|
|
| CATALOG |
| HMC424ALP3E COUNTRY OF ORIGIN |
HMC424ALP3E PARAMETRIC INFO
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HMC424ALP3E PACKAGE INFO
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HMC424ALP3E MANUFACTURING INFO
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HMC424ALP3E PACKAGING INFO
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HMC424ALP3E ECAD MODELS
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HMC424ALP3E FUNCTIONAL BLOCK DIAGRAM
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HMC424ALP3E APPLICATIONS
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COUNTRY OF ORIGIN
|
| Korea (Republic of) |
Taiwan (Province of China)
|
United States of America
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|
PARAMETRIC INFO
|
| Number of Bits |
6 |
| Maximum Attenuation (dB) |
31.5(Typ) |
| Attenuator Step Size (dB) |
0.5 |
| Minimum Frequency (MHz) |
0 |
| Maximum Frequency (MHz) |
13000 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Operating Supply Voltage (V) |
-5.5 |
| Typical Operating Supply Voltage (V) |
-5 |
| Maximum Operating Supply Voltage (V) |
-4.5 |
| Maximum Supply Current (A) |
0.005 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
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| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
No Lead |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
3 |
| Package Overall Height (mm) |
0.85 |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220 |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ag |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
|
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ECAD MODELS
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FUNCTIONAL BLOCK DIAGRAM
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APPLICATIONS
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• Basestation Infrastructure
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• Fiber Optics & Broadband Telecom
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• Microwave & VSAT Radios
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• Military & Space
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• Test Instrumentation
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