|
|
• 0.5 dB LSB Steps to 31.5 dB
|
• Single Control Line Per Bit
|
• ± 0.5 dB Typical Bit Error
|
• Single +5V Supply
|
|
| CATALOG |
HMC425ALP3ETR COUNTRY OF ORIGIN
|
HMC425ALP3ETR PARAMETRIC INFO
|
HMC425ALP3ETR PACKAGE INFO
|
HMC425ALP3ETR MANUFACTURING INFO
|
HMC425ALP3ETR PACKAGING INFO
|
HMC425ALP3ETR ECAD MODELS
|
HMC425ALP3ETR APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
United States of America
|
Korea (Republic of)
|
|
PARAMETRIC INFO
|
| Number of Bits |
6 |
| Number of Channels |
1 |
| Maximum Attenuation (dB) |
31.5(Typ) |
| Attenuator Step Size (dB) |
0.5 |
| Minimum Frequency (MHz) |
2200 |
| Maximum Frequency (MHz) |
8000 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Operating Supply Voltage (V) |
5 |
| Typical Insertion Loss (dB) |
4.5 |
| Maximum Input Power |
25dBm(Typ) |
| Maximum Supply Current (A) |
0.00003 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
No Lead |
| PCB |
16 |
| Tab |
N/R |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Lead Finish(Plating) |
Matte Sn annealed |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • WLAN & Point-to-Multi-Point |
| • Fiber Optics & Broadband Telecom |
| • Microwave Radio & VSAT |
| • Military |
| |
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