HMC451LC3TR Analog Devices IC RF AMP GP 5GHZ-20GHZ 16SMT

label:
2025/08/21 13
HMC451LC3TR Analog Devices  IC RF AMP GP 5GHZ-20GHZ 16SMT


• Gain: 19 dB
• Saturated Power: +21 dBm @ 21% PAE
• Output IP3: +30 dBm
• Single Supply: +5V @ 114 mA
• 50 Ohm Matched Input/Output


CATALOG
HMC451LC3TR COUNTRY OF ORIGIN
HMC451LC3TR PARAMETRIC INFO
HMC451LC3TR PACKAGE INFO
HMC451LC3TR MANUFACTURING INFO
HMC451LC3TR PACKAGING INFO
HMC451LC3TR ECAD MODELS
HMC451LC3TR APPLICATIONS


COUNTRY OF ORIGIN
United States of America


PARAMETRIC INFO
Manufacturer Type Low Noise Amplifier
Number of Channels per Chip 1
Typical Power Gain (dB) 17@20000MHz
Typical Noise Figure (dB) 7@20000MHz
Operational Bias Conditions 5V/114mA
Typical Output 1dB Compressed Power @ Bias Conditions (dBm) 19.5
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm) 29
Typical Output Intercept Point (dBm) 29@20000MHz
Minimum Operating Frequency (MHz) 5000
Maximum Power Dissipation (mW) 1100
Maximum Operating Frequency (MHz) 20000
Typical Output Power (dBm) 19.5@20000MHz
Typical Output Power Range (dBm) 15 to 20
Maximum Input Return Loss (dB) 12(Typ)@20000MHz
Maximum Output Return Loss (dB) 8(Typ)@20000MHz
Power Supply Type Single
Typical Single Supply Voltage (V) 5
Maximum Single Supply Voltage (V) 5.5
Maximum Operating Supply Voltage (V) 5.5
Maximum Supply Current (mA) 114(Typ)@5V
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package CLLCC EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 16
Lead Shape No Lead
PCB 16
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 2.9
Package Width (mm) 2.9
Package Height (mm) 0.8
Package Diameter (mm) N/R
Package Overall Length (mm) 2.9
Package Overall Width (mm) 2.9
Package Overall Height (mm) 0.8
Seated Plane Height (mm) 0.8
Mounting Surface Mount
Terminal Width (mm) 0.3
Package Weight (g) N/A
Package Material Ceramic
Package Description Ceramic Leadless Chip Carrier, Exposed Pad
Package Family Name LCC
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Ni
Terminal Base Material N/A
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 100
Reel Diameter (in) 13
 
ECAD MODELS


APPLICATIONS
• Microwave Radio & VSAT
• Military & Space
• Test Equipment & Sensors
• Fiber Optics
• LO Driver for HMC Mixers
Продукт RFQ