HMC451LP3ETR Analog Devices IC RF AMP GP 5GHZ-18GHZ 16SMT

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2024/09/6 155

HMC451LP3ETR Analog Devices IC RF AMP GP 5GHZ-18GHZ 16SMT

• Gain: 18 dB

• Saturated Power: +21 dBm @ 18% PAE

• Output IP3: +28 dBm

• Single Supply: +5V @ 120 mA

• 50 Ohm Matched Input/Output

• 16 Lead 3x3mm SMT Package: 9mm²

CATALOG

HMC451LP3ETR COUNTRY OF ORIGIN

HMC451LP3ETR PARAMETRIC INFO

HMC451LP3ETR PACKAGE INFO

HMC451LP3ETR MANUFACTURING INFO

HMC451LP3ETR PACKAGING INFO

HMC451LP3ETR ECAD MODLES

HMC451LP3ETR FUNCTIONAL DIAGRAM

HMC451LP3ETR APPLICATIONS

COUNTRY OF ORIGIN

United States of America

Malaysia

Korea (Republic of)

Philippines

PARAMETRIC INFO

Manufacturer Type	Power Amplifier
Number of Channels per Chip	1
Typical Power Gain (dB)	16@18000MHz
Typical Noise Figure (dB)	7@18000MHz
Process Technology	pHEMT
Typical Output 1dB Compressed Power @ Bias Conditions (dBm)	19.5
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm)	25
Typical Output Intercept Point (dBm)	25@18000MHz
Minimum Operating Frequency (MHz)	5000
Maximum Power Dissipation (mW)	830
Maximum Operating Frequency (MHz)	18000
Typical Output Power (dBm)	19@18000MHz
Typical Output Power Range (dBm)	15 to 20
Maximum Input Return Loss (dB)	13(Typ)@18000MHz
Maximum Output Return Loss (dB)	8(Typ)@18000MHz
Power Supply Type	Single
Typical Single Supply Voltage (V)	5
Maximum Single Supply Voltage (V)	5.5
Maximum Operating Supply Voltage (V)	5.5
Maximum Supply Current (mA)	150@5V
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85

Supplier Package	QFN EP
Basic Package Type	Non-Lead-Frame SMT
Pin Count	16
Lead Shape	No Lead
PCB	16
Tab	N/R
Pin Pitch (mm)	0.56(Max)
Package Length (mm)	3.1(Max)
Package Width (mm)	3.1(Max)
Package Height (mm)	0.95(Max)
Package Diameter (mm)	N/R
Package Overall Length (mm)	3.1(Max)
Package Overall Width (mm)	3.1(Max)
Package Overall Height (mm)	1(Max)
Seated Plane Height (mm)	1(Max)
Mounting	Surface Mount
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Quad Flat No Lead Package, Exposed Pad
Package Family Name	QFN
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	1
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	N/A
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Lead Finish(Plating)	Matte Sn annealed

Packaging Suffix	TR
Packaging	Tape and Reel
Quantity Of Packaging	500
Packaging Document	Link to Datasheet

FUNCTIONAL DIAGRAM

• Microwave Radio & VSAT

• Military & Space

• Test Equipment & Sensors

• Fiber Optics