HMC565LC5 onsemi IC AMP VSAT DBS 6GHZ-20GHZ 32QFN

label:
2025/10/16 15
HMC565LC5 onsemi  IC AMP VSAT DBS 6GHZ-20GHZ 32QFN


• Noise Figure: 2.5 dB
• Gain: 21 dB
• OIP3: 20 dBm
• Single Supply: +3V @ 53 mA
• 50 Ohm Matched Input/Output


CATALOG
HMC565LC5 COUNTRY OF ORIGIN
HMC565LC5 PARAMETRIC INFO
HMC565LC5 PACKAGE INFO
HMC565LC5 MANUFACTURING INFO
HMC565LC5 PACKAGING INFO
HMC565LC5 ECAD MODELS
HMC565LC5 APPLICATIONS


COUNTRY OF ORIGIN
United States of America


PARAMETRIC INFO
Manufacturer Type Low Noise Amplifier
Number of Channels per Chip 1
Typical Power Gain (dB) 18.5@20000MHz
Typical Noise Figure (dB) 2.5@20000MHz
Process Technology 0.25um
Operational Bias Conditions 3V/53mA
Typical Output 1dB Compressed Power @ Bias Conditions (dBm) 11
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm) 21
Typical Output Intercept Point (dBm) 21@20000MHz
Minimum Operating Frequency (MHz) 6000
Maximum Power Dissipation (mW) 753
Maximum Operating Frequency (MHz) 20000
Typical Output Power (dBm) 11@20000MHz
Typical Output Power Range (dBm) 10 to 15
Maximum Input Return Loss (dB) 12(Typ)@20000MHz
Maximum Output Return Loss (dB) 15(Typ)@20000MHz
Power Supply Type Single
Typical Single Supply Voltage (V) 3
Maximum Single Supply Voltage (V) 3.5
Maximum Operating Supply Voltage (V) 3.5
Maximum Supply Current (mA) 75@3V
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package CLLCC EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 32
Lead Shape No Lead
PCB 32
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 4.9
Package Width (mm) 4.9
Package Height (mm) 1
Package Diameter (mm) N/R
Package Overall Length (mm) 4.9
Package Overall Width (mm) 4.9
Package Overall Height (mm) 1
Seated Plane Height (mm) 1
Mounting Surface Mount
Terminal Width (mm) 0.3
Package Weight (g) N/A
Package Material Ceramic
Package Description Ceramic Leadless Chip Carrier, Exposed Pad
Package Family Name LCC
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Ni
Terminal Base Material W
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Cut Tape
Quantity Of Packaging 500
Packaging Document Link to Datasheet
 
ECAD MODELS  


APPLICATIONS
• Point-to-Point Radios
• Point-to-Multi-Point Radios & VSAT
• Test Equipment and Sensors
• Military & Space
Продукт RFQ