|
|
• High Output Power: +17 dBm
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• Low Input Power Drive: -2 to +6 dBm
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• Fo, 3Fo Isolation: 15 dBc
|
• 100 KHz SSB Phase Noise: -140 dBc/Hz
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• Single Supply: +5V@ 90 mA
|
• RoHS Compliant 4x4 mm SMT Package
|
|
| CATALOG |
| HMC575LP4ETR COUNTRY OF ORIGIN |
HMC575LP4ETR PARAMETRIC INFO
|
HMC575LP4ETR PACKAGE INFO
|
HMC575LP4ETR MANUFACTURING INFO
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HMC575LP4ETR PACKAGING INFO
|
HMC575LP4ETR ECAD MODELS
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HMC575LP4ETR FUNCTIONAL BLOCK DIAGRAM
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HMC575LP4ETR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
| Malaysia |
Taiwan (Province of China)
|
|
PARAMETRIC INFO
|
| Frequency Multiplier Type |
Active |
| Multiplying Factor |
x2 |
| Input Frequency Range (GHz) |
3 to 4.5 |
| Output Frequency Range (GHz) |
6 to 9 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Typical Output Power (dBm) |
17 |
| Maximum Input Power |
6dBm |
| Typical Input Return Loss (dB) |
15 |
| Typical Output Return Loss (dB) |
12 |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Typical Operating Supply Voltage (V) |
5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Maximum Supply Current (mA) |
91(Typ) |
| Typical Phase Noise (dBc/Hz) |
-140 |
| Maximum Power Dissipation (mW) |
512 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
0.9 |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220VGGD-8 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Reel Diameter (in) |
13 |
|
|
ECAD MODELS
|
|
|
FUNCTIONAL BLOCK DIAGRAM
|
|
|
| APPLICATION |
• Wireless Local Loop
|
• Point-to-Point & VSAT Radios
|
• Test Instrumentation
|
• Military & Space
|
| |
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