HMC589AST89ETR Analog Devices IC RF AMP WLAN 0HZ-4GHZ SOT89-3

label:
2025/09/9 19
HMC589AST89ETR Analog Devices  IC RF AMP WLAN 0HZ-4GHZ SOT89-3


• P1dB Output Power: +21 dBm
• Gain: 21 dB
• Output IP3: +33 dBm
• Single Supply: +5V
• Industry Standard SOT89E Package


CATALOG
HMC589AST89ETR COUNTRY OF ORIGIN
HMC589AST89ETR PARAMETRIC INFO
HMC589AST89ETR PACKAGE INFO
HMC589AST89ETR MANUFACTURING INFO
HMC589AST89ETR PACKAGING INFO
HMC589AST89ETR APPLICATIONS


COUNTRY OF ORIGIN
Philippines


PARAMETRIC INFO
Manufacturer Type MMIC Amplifier
Number of Channels per Chip 1
Typical Power Gain (dB) 16@4000MHz
Typical Noise Figure (dB) 4.5@4000MHz
Process Technology InGaP HBT
Operational Bias Conditions 5V/82mA
Typical Output 1dB Compressed Power @ Bias Conditions (dBm) 18
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm) 29
Typical Output Intercept Point (dBm) 29@4000MHz
Maximum Reverse Isolation (dB) 23(Typ)@4000MHz
Maximum Power Dissipation (mW) 510
Maximum Operating Frequency (MHz) 4000
Typical Output Power (dBm) 18@4000MHz
Typical Output Power Range (dBm) 15 to 20
Maximum Input Return Loss (dB) 10(Typ)@4000MHz
Maximum Output Return Loss (dB) 8(Typ)@4000MHz
Power Supply Type Single
Typical Single Supply Voltage (V) 5
Maximum Single Supply Voltage (V) 5.5
Maximum Operating Supply Voltage (V) 5.5
Maximum Supply Current (mA) 102@5V
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package SOT-89
Pin Count 4
PCB 3
Tab Tab
Pin Pitch (mm) 1.5
Package Length (mm) 4.6(Max)
Package Width (mm) 2.6(Max)
Package Height (mm) 1.6(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 1.6(Max)
Mounting Surface Mount
Package Material Plastic
Package Family Name SOT
Jedec TO-243AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Lead Finish(Plating) Matte Sn annealed


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 500


APPLICATIONS
• Cellular / PCS / 3G
• Fixed Wireless & WLAN
• CATV, Cable Modem & DBS
• Microwave Radio & Test Equipment
• IF & RF Applications
Продукт RFQ