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• Broadband frequency range: 0.1 GHz to 20 GHz
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• Nonreflective 50 Ω design
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• Low insertion loss: 3.0 dB at 20 GHz
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• High isolation: 40 dB at 20 GHz
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• High input linearity at 250 MHz to 20 GHz P1dB: 24 dBm typical IP3: 41 dBm typical
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• High power handling 26.5 dBm through path 23 dBm terminated path
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• Integrated 2 to 4 line decoder
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• 24-lead, 4 mm × 4 mm LFCSP package
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• ESD rating: 250 V (Class 1A)
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CATALOG |
HMC641ALP4ETR COUNTRY OF ORIGIN
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HMC641ALP4ETR PARAMETRIC INFO
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HMC641ALP4ETR PACKAGE INFO
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HMC641ALP4ETR MANUFACTURING INFO
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HMC641ALP4ETR PACKAGING INFO
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HMC641ALP4ETR APPLICATIONS
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COUNTRY OF ORIGIN
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Korea (Republic of)
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Malaysia
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United States of America
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PARAMETRIC INFO
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Switch Type |
SP4T |
Number of Switches |
1 |
Switch Configuration |
Single SP4T |
Frequency Band (MHz) |
100 to 20000 |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
85 |
Maximum Insertion Loss (dB) |
3(Typ) |
Maximum Frequency (MHz) |
20000 |
Technology |
GaAs MMIC |
Switching Speed (ns) |
0.00003(Typ) |
Minimum Isolation Voltage (dB) |
30 |
Typical Input 1dB Compressed Power (dBm) |
24 |
Minimum Storage Temperature (°C) |
-65 |
Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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Supplier Package |
LFCSP EP |
Basic Package Type |
Non-Lead-Frame SMT |
Pin Count |
24 |
Lead Shape |
No Lead |
PCB |
24 |
Tab |
N/R |
Pin Pitch (mm) |
0.5 |
Package Length (mm) |
4 |
Package Width (mm) |
4 |
Package Height (mm) |
0.83 |
Package Diameter (mm) |
N/R |
Seated Plane Height (mm) |
0.85 |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
Package Family Name |
CSP |
Jedec |
MO-220VGGD-2 |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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MSL |
3 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
N/A |
Maximum Wave Temperature (°C) |
N/R |
Wave Solder Time (Sec) |
N/R |
Lead Finish(Plating) |
Matte Sn annealed |
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PACKAGING INFO
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Packaging |
Tape and Reel |
Quantity Of Packaging |
500 |
Packaging Document |
Link to Datasheet |
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APPLICATIONS |
• Test instrumentation |
• Microwave radios and very small aperture terminals (VSATs) |
• Military radios, radars, and electronic counter measures (ECMs) |
• Broadband telecommunications systems |
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