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• Broadband frequency range: 0.1 GHz to 20 GHz
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• Nonreflective 50 Ω design
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• Low insertion loss: 3.0 dB at 20 GHz
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• High isolation: 40 dB at 20 GHz
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• High input linearity at 250 MHz to 20 GHz P1dB: 24 dBm typical IP3: 41 dBm typical
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• High power handling 26.5 dBm through path 23 dBm terminated path
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• Integrated 2 to 4 line decoder
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• 24-lead, 4 mm × 4 mm LFCSP package
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• ESD rating: 250 V (Class 1A)
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|
| CATALOG |
HMC641ALP4ETR COUNTRY OF ORIGIN
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HMC641ALP4ETR PARAMETRIC INFO
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HMC641ALP4ETR PACKAGE INFO
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HMC641ALP4ETR MANUFACTURING INFO
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HMC641ALP4ETR PACKAGING INFO
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HMC641ALP4ETR APPLICATIONS
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COUNTRY OF ORIGIN
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Korea (Republic of)
|
Malaysia
|
United States of America
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|
PARAMETRIC INFO
|
| Switch Type |
SP4T |
| Number of Switches |
1 |
| Switch Configuration |
Single SP4T |
| Frequency Band (MHz) |
100 to 20000 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Insertion Loss (dB) |
3(Typ) |
| Maximum Frequency (MHz) |
20000 |
| Technology |
GaAs MMIC |
| Switching Speed (ns) |
0.00003(Typ) |
| Minimum Isolation Voltage (dB) |
30 |
| Typical Input 1dB Compressed Power (dBm) |
24 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220VGGD-2 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
N/A |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
|
|
PACKAGING INFO
|
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Packaging Document |
Link to Datasheet |
|
|
| APPLICATIONS |
| • Test instrumentation |
| • Microwave radios and very small aperture terminals (VSATs) |
| • Military radios, radars, and electronic counter measures (ECMs) |
| • Broadband telecommunications systems |
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