HMC659LC5TR Analog Devices IC RF AMP GP 0HZ-15GHZ 32CSMT

label:
2024/03/14 283



• P1dB Output Power: +27.5 dBm
• Gain: 19 dB
• Output IP3: +35 dBm
• Supply Voltage: +8V @ 300 mA
• 50 Ohm Matched Input/Output
• 32 Lead Ceramic 5 x 5 mm SMT Package: 25 mm2


CATALOG
HMC659LC5TR Country of Origin
HMC659LC5TR Parametric Info
HMC659LC5TR Package Info
HMC659LC5TR Manufacturing Info
HMC659LC5TR Packaging Info
HMC659LC5TR Applications


COUNTRY OF ORIGIN
United States of America


PARAMETRIC INFO
Manufacturer Type Power Amplifier
Number of Channels per Chip 1
Typical Power Gain (dB) 17@15000MHz
Typical Noise Figure (dB) 3.5@15000MHz
Typical Gain Flatness (dB) ±0.7
Operational Bias Conditions 8V/300mA
Typical Output 1dB Compressed Power @ Bias Conditions (dBm) 26.5
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm) 29
Process Technology pHEMT
Typical Output Intercept Point (dBm) 29@15000MHz
Maximum Power Dissipation (mW) 3300
Maximum Operating Frequency (MHz) 15000
Typical Output Power (dBm) 26.5@15000MHz
Typical Output Power Range (dBm) 20 to 30
Maximum Input Return Loss (dB) 17(Typ)@15000MHz
Maximum Output Return Loss (dB) 15(Typ)@15000MHz
Power Supply Type Single
Typical Single Supply Voltage (V) 8
Maximum Single Supply Voltage (V) 9
Maximum Operating Supply Voltage (V) 9
Maximum Supply Current (mA) 300(Typ)@8V
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package LFCSP EP
Pin Count 32
Lead Shape No Lead
PCB 32
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 5
Package Width (mm) 5
Package Height (mm) 1.2
Package Diameter (mm) N/R
Mounting Surface Mount
Package Material Plastic
Package Description Lead Frame Chip Scale Package, Exposed Pad
Package Family Name CSP
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Ni
Terminal Base Material N/A


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 100
Reel Diameter (in) 13
Packaging Document Link to Datasheet


APPLICATIONS
The HMC659LC5 wideband PA is ideal for:  
• Telecom Infrastructure
• Microwave Radio & VSAT
• Military & Space
• Test Instrumentation
• Fiber Optics



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