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• Ultra Low SSB Phase Noise Floor:-153 dBc/Hz @ 10 kHz offset @ 100 MHz Reference Frequency.
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• Programmable Divider (N= 12 - 259) Operating up to 7 GHz
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• Open Collector Output Buffer Amplifiers for Interfacing w/ Op-Amp Based Loop Filter
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• Reversible Polarity PFD w/ Lock Detect Output
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• 32 Lead 5x5mm SMT Package: 25mm2
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| CATALOG |
HMC698LP5ETR COUNTRY OF ORIGIN
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HMC698LP5ETR PARAMETRIC INFO
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HMC698LP5ETR PACKAGE INFO
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HMC698LP5ETR MANUFACTURING INFO
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HMC698LP5ETR PACKAGING INFO
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HMC698LP5ETR ECAD MODELS
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HMC698LP5ETR FUNCTIONAL DIAGRAM
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HMC698LP5ETR APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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|
PARAMETRIC INFO
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| Number of Outputs per Chip |
1 |
| Clock Input Frequency (MHz) |
10 to 1300 |
| Input Logic Level |
CMOS|TTL |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Input Signal Type |
Differential |
| Output Signal Type |
Single-Ended |
| Hitless Protection Switching |
No |
| Frequency Margining |
No |
| Programmability |
Yes |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Supply Voltage (V) |
4.75 |
| Typical Operating Supply Voltage (V) |
5 |
| Maximum Operating Supply Voltage (V) |
5.25 |
| Number of Clock Inputs |
1 |
| Spread Spectrum |
No |
| Maximum Supply Current (mA) |
340 |
|
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PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
32 |
| Lead Shape |
No Lead |
| PCB |
32 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
5 |
| Package Width (mm) |
5 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5 |
| Package Overall Width (mm) |
5 |
| Package Overall Height (mm) |
0.9 |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220VHHD-4 |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Reel Diameter (in) |
13 |
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| ECAD MODELS |
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FUNCTIONAL DIAGRAM
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APPLICATIONS
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• Satellite Communication Systems
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• Point-to-Point Radios
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• Military Applications
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• Sonet Clock Generation
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