HMC773ALC3BTR Analog Devices IC MIXER 6-26GHZ DUAL 12QFN

2025/10/9 18

CATALOG

United States of America

Maximum Input Frequency (MHz)	26000
Maximum Output Frequency (MHz)	8000
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Minimum Input Frequency (MHz)	6000
Minimum Output Frequency (MHz)	0
Maximum Conversion Loss (dB)	12
Maximum Power Dissipation (mW)	400
Typical Third Order Input Intercept Point (dBm)	20
Typical LO/RF Isolation (dB)	37
Typical Noise Figure (dB)	12
Minimum Storage Temperature (°C)	-65
Maximum Storage Temperature (°C)	150

Supplier Package	CLLCC EP
Basic Package Type	Non-Lead-Frame SMT
Pin Count	12
Lead Shape	No Lead
PCB	12
Tab	N/R
Pin Pitch (mm)	0.5
Package Length (mm)	3
Package Width (mm)	3
Package Height (mm)	0.92(Max)
Package Diameter (mm)	N/R
Seated Plane Height (mm)	0.92(Max)
Mounting	Surface Mount
Terminal Width (mm)	0.3(Max)
Package Weight (g)	N/A
Package Material	Ceramic
Package Description	Ceramic Leadless Chip Carrier, Exposed Pad
Package Family Name	LCC
Jedec	N/A
Package Outline	Link to Datasheet

MSL	3
Maximum Reflow Temperature (°C)	260
Reflow Solder Time (Sec)	30
Number of Reflow Cycle	3
Standard	J-STD-020D
Maximum Wave Temperature (°C)	N/R
Wave Solder Time (Sec)	N/R
Wave Temp. Source	Link to Datasheet
Lead Finish(Plating)	Au
Under Plating Material	Ni
Terminal Base Material	W
Number of Wave Cycles	N/R