HMC773ALC3BTR Analog Devices IC MIXER 6-26GHZ DUAL 12QFN

label:
2025/10/9 18
HMC773ALC3BTR Analog Devices  IC MIXER 6-26GHZ DUAL 12QFN


CATALOG
HMC773ALC3BTR COUNTRY OF ORIGIN
HMC773ALC3BTR PARAMETRIC INFO
HMC773ALC3BTR PACKAGE INFO
HMC773ALC3BTR MANUFACTURING INFO
HMC773ALC3BTR PACKAGING INFO
HMC773ALC3BTR ECAD MODELS


COUNTRY OF ORIGIN
United States of America


PARAMETRIC INFO
Maximum Input Frequency (MHz) 26000
Maximum Output Frequency (MHz) 8000
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Input Frequency (MHz) 6000
Minimum Output Frequency (MHz) 0
Maximum Conversion Loss (dB) 12
Maximum Power Dissipation (mW) 400
Typical Third Order Input Intercept Point (dBm) 20
Typical LO/RF Isolation (dB) 37
Typical Noise Figure (dB) 12
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package CLLCC EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 12
Lead Shape No Lead
PCB 12
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 3
Package Width (mm) 3
Package Height (mm) 0.92(Max)
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.92(Max)
Mounting Surface Mount
Terminal Width (mm) 0.3(Max)
Package Weight (g) N/A
Package Material Ceramic
Package Description Ceramic Leadless Chip Carrier, Exposed Pad
Package Family Name LCC
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Au
Under Plating Material Ni
Terminal Base Material W
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 100
Reel Diameter (in) 7
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet
Tape Material Plastic
Tape Type Embossed


ECAD MODELS


Продукт RFQ