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• Nonreflective, 50 Ω design
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• High isolation: 45 dB typical at 2 GHz
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• Low insertion loss: 0.6 dB at 2 GHz
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• High power handling 33 dBm through path 27 dBm terminated path
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• High linearity 1 dB compression (P1dB): 35 dBm typical Input third-order intercept (IIP3): 58 dBm typical
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• ESD rating: 2 kV human body model (HBM), Class 2
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• Single positive supply: 3.3 V to 5.0 V
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| CATALOG |
HMC7992LP3DETR COUNTRY OF ORIGIN
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HMC7992LP3DETR PARAMETRIC INFO
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HMC7992LP3DETR PACKAGE INFO
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HMC7992LP3DETR MANUFACTURING INFO
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HMC7992LP3DETR PACKAGING INFO
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HMC7992LP3DETR APPLICATIONS
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COUNTRY OF ORIGIN
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Malaysia
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Korea (Republic of)
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PARAMETRIC INFO
|
| Switch Type |
SP4T |
| Number of Switches |
1 |
| Switch Configuration |
Single SP4T |
| Frequency Band (MHz) |
100 to 6000 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Maximum Insertion Loss (dB) |
1.5 |
| Maximum Frequency (MHz) |
6000 |
| Technology |
CMOS/TTL |
| Switching Speed (ns) |
0.00003(Typ) |
| Minimum Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
5 |
| Minimum Isolation Voltage (dB) |
25 |
| Typical Supply Current (mA) |
0.18 |
| Typical Input 1dB Compressed Power (dBm) |
35 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
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|
PACKAGE INFO
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| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
No Lead |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3 |
| Package Width (mm) |
3 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3 |
| Package Overall Width (mm) |
3 |
| Package Overall Height (mm) |
0.85 |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220VEED-4 |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
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APPLICATIONS
|
| • Cellular/4G infrastructure |
| • Wireless infrastructure |
| • Automotive telematics |
| • Mobile radios |
| • Test equipment |
| |
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