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• Nonreflective, 50 Ω design
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• High isolation: 60 dB typical
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• Low insertion loss: 0.8 dB typical
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• All off state control
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| CATALOG |
HMC8038LP4CETR COUNTRY OF ORIGIN
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HMC8038LP4CETR PARAMETRIC INFO
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HMC8038LP4CETR PACKAGE INFO
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HMC8038LP4CETR MANUFACTURING INFO
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HMC8038LP4CETR PACKAGING INFO
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HMC8038LP4CETR ECAD MODELS
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HMC8038LP4CETR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Korea (Republic of)
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|
PARAMETRIC INFO
|
| Switch Type |
SPDT |
| Number of Switches |
1 |
| Switch Configuration |
Single SPDT |
| Frequency Band (MHz) |
100 to 6000 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
105 |
| Maximum Insertion Loss (dB) |
1.3 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Frequency (MHz) |
6000 |
| Switching Speed (ns) |
0.00006(Typ) |
| Minimum Operating Supply Voltage (V) |
3 |
| Maximum Input Power |
35dBm |
| Maximum Operating Supply Voltage (V) |
5.4 |
| Minimum Isolation Voltage (dB) |
40 |
| Typical Supply Current (mA) |
0.16 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Frequency (MHz) |
100 |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
16 |
| Lead Shape |
No Lead |
| PCB |
16 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
0.88 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
0.9 |
| Seated Plane Height (mm) |
0.9 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.33 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220VGGC-4 |
| Package Outline |
Link to Datasheet |
| Maximum PACKAGE_DIMENSION_L |
4.1 |
| Minimum PACKAGE_DIMENSION_L |
3.9 |
| Maximum PACKAGE_DIMENSION_W |
4.1 |
| Minimum PACKAGE_DIMENSION_W |
3.9 |
| Maximum Diameter |
N/R |
| Minimum Diameter |
N/R |
| Minimum Seated_Plane_Height |
0.8 |
| Minimum PACKAGE_DIMENSION_H |
0.8 |
| Maximum PACKAGE_DIMENSION_H |
0.95 |
| Maximum Seated_Plane_Height |
1 |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Reel Diameter (in) |
7 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
| Tape Material |
Plastic |
| Tape Type |
Embossed |
|
| |
| ECAD MODELS |
 |
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| APPLICATIONS |
| • Cellular/4G infrastructure |
| • Wireless infrastructure |
| • Automotive telematics |
| • Mobile radios |
| • Test equipment |
| |
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