|
| |
• Passive, wideband I/Q mixer
|
• RF and LO range: 6 GHz to 26.5 GHz
|
• Wide IF bandwidth of dc to 5 GHz
|
| • Single-ended RF, LO, and IF |
| • Conversion loss: 9 dB (typical) |
| • Image rejection: 25 dBc (typical) |
| • Single-sideband noise figure: 9 dB (typical) |
| • Input IP3 (downconverter): 24 dBm (typical) |
| • Input P1dB compression point (downconverter): 15 dBm(typical) |
| • Input IP2: 55 dBm (typical) |
| |
| CATALOG |
| HMC8191LC4TR COUNTRY OF ORIGIN |
HMC8191LC4TR PARAMETRIC INFO
|
HMC8191LC4TR PACKAGE INFO
|
HMC8191LC4TR MANUFACTURING INFO
|
HMC8191LC4TR PACKAGING INFO
|
HMC8191LC4TR EACD MODELS
|
| HMC8191LC4TR FUNCTIONAL BLOCK DIAGRAM |
| HMC8191LC4TR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| United States of America |
|
PARAMETRIC INFO
|
| Maximum Input Frequency (MHz) |
26500 |
| Maximum Output Frequency (MHz) |
5000 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Process Technology |
GaAs MESFET |
| Minimum Input Frequency (MHz) |
6000 |
| Minimum Output Frequency (MHz) |
0 |
| Maximum Conversion Loss (dB) |
11.5 |
| Maximum Power Dissipation (mW) |
657 |
| Typical Third Order Input Intercept Point (dBm) |
24 |
| Typical LO/RF Isolation (dB) |
40 |
| Typical Noise Figure (dB) |
9 |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
| Supplier Package |
CLLCC |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
24 |
| Lead Shape |
No Lead |
| PCB |
24 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.56(Max) |
| Package Length (mm) |
4 |
| Package Width (mm) |
4 |
| Package Height (mm) |
1.02(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
4 |
| Package Overall Width (mm) |
4 |
| Package Overall Height (mm) |
1.02(Max) |
| Seated Plane Height (mm) |
1.02(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Ceramic Leadless Chip Carrier |
| Package Family Name |
LCC |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
N/A |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
100 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
| |
| APPLICATIONS |
| • Test and measurement instrumentation |
| • Military, aerospace, and defense applications |
| • Microwave point to point base stations |
| |
One-stop supplier of IC products