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• RF Bandwidth:25 - 6000 MHz
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• Maximum Phase Detector Rate100 MHz
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• Ultra Low Phase Noise-110 dBc/Hz in Band Typ.
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• Figure of Merit (FOM) -227 dBc/Hz
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|
| CATALOG |
HMC833LP6GETR COUNTRY OF ORIGIN
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HMC833LP6GETR LIFECYCLE
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HMC833LP6GETR PARAMETRIC INFO
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HMC833LP6GETR PACKAGE INFO
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HMC833LP6GETR MANUFACTURING INFO
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HMC833LP6GETR PACKAGING INFO
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HMC833LP6GETR ECAD MODELS
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HMC833LP6GETR APPLICATIONS
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|
COUNTRY OF ORIGIN
|
Malaysia
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|
LIFECYCLE
|
Obsolete
Aug 31,2022
|
|
PARAMETRIC INFO
|
| Number of Outputs per Chip |
1 |
| Clock Input Frequency (MHz) |
Up to 350 |
| Maximum Output Frequency (MHz) |
6000 |
| Input Logic Level |
CMOS |
| Output Logic Level |
CMOS |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Internal/External Clock Type |
VCO |
| Input Signal Type |
Single-Ended |
| Output Signal Type |
Single-Ended |
| Hitless Protection Switching |
No |
| Frequency Margining |
No |
| Programmability |
Yes |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Operating Supply Voltage (V) |
3 |
| Typical Operating Supply Voltage (V) |
3.3|5 |
| Maximum Operating Supply Voltage (V) |
5.2 |
| Number of Clock Inputs |
1 |
| Spread Spectrum |
No |
|
|
PACKAGE INFO
|
| Supplier Package |
LFCSP EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
40 |
| Lead Shape |
No Lead |
| PCB |
40 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
6 |
| Package Width (mm) |
6 |
| Package Height (mm) |
0.83 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
6 |
| Package Overall Width (mm) |
6 |
| Package Overall Height (mm) |
0.85 |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Terminal Width (mm) |
0.25 |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Lead Frame Chip Scale Package, Exposed Pad |
| Package Family Name |
CSP |
| Jedec |
MO-220VJJD-5 |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
40 |
| Number of Reflow Cycle |
N/A |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
500 |
| Reel Diameter (in) |
13 |
|
| |
| ECAD MODELS |
 |
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| APPLICATIONS |
| • Cellular Infrastructure |
| • Microwave Radio |
| • WiMax, WiFi |
| • Communications Test Equipment |
| |
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