HMC8410LP2FETR Analog Devices IC AMP RADAR 10MHZ-10GHZ 6LFCSP

label:
2025/08/21 13
HMC8410LP2FETR Analog Devices IC AMP RADAR 10MHZ-10GHZ 6LFCSP


• Low noise figure: 1.1 dB typical
• High gain: 19.5 dB typical
• High output third-order intercept (IP3): 33 dBm typical


CATALOG
HMC8410LP2FETR COUNTRY OF ORIGIN
HMC8410LP2FETR PARAMETRIC INFO
HMC8410LP2FETR PACKAGE INFO
HMC8410LP2FETR MANUFACTURING INFO
HMC8410LP2FETR PACKAGING INFO
HMC8410LP2FETR ECAD MODELS
HMC8410LP2FETR APPLICATIONS


COUNTRY OF ORIGIN
Malaysia


PARAMETRIC INFO
Manufacturer Type Low Noise Amplifier
Number of Channels per Chip 1
Typical Power Gain (dB) 16@10000MHz
Typical Noise Figure (dB) 1.7@10000MHz
Process Technology pHEMT
Operational Bias Conditions 5V/65mA
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm) 33
Typical Output Intercept Point (dBm) 33@10000MHz
Minimum Operating Frequency (MHz) 10
Maximum Power Dissipation (mW) 1300
Maximum Operating Frequency (MHz) 10000
Typical Output Power (dBm) 19.5@10000MHz
Typical Output Power Range (dBm) 15 to 20
Maximum Input Return Loss (dB) 8(Typ)@10000MHz
Maximum Output Return Loss (dB) 7(Typ)@10000MHz
Power Supply Type Single
Minimum Single Supply Voltage (V) 2
Typical Single Supply Voltage (V) 5
Maximum Single Supply Voltage (V) 6
Maximum Operating Supply Voltage (V) 6
Maximum Supply Current (mA) 80@5V
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package LFCSP EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 6
Lead Shape No Lead
PCB 6
Tab N/R
Pin Pitch (mm) 0.65
Package Length (mm) 2
Package Width (mm) 2
Package Height (mm) 0.83
Package Diameter (mm) N/R
Seated Plane Height (mm) 0.85
Mounting Surface Mount
Terminal Width (mm) 0.3
Package Weight (g) N/A
Package Material Plastic
Package Description Lead Frame Chip Scale Package, Exposed Pad
Package Family Name CSP
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 500
Reel Diameter (in) 13
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q2
Packaging Document Link to Datasheet
Tape Material Plastic
Tape Type Embossed


ECAD MODELS



APPLICATIONS
• Software defined radios
• Electronic warfare
• Radar applications  
Продукт RFQ