HMC902LP3ETR Analog Devices IC RF AMP GP 5GHZ-10GHZ 16QFN

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2024/10/17 159
HMC902LP3ETR Analog Devices 	IC RF AMP GP 5GHZ-10GHZ 16QFN


• Low noise figure: 1.8 dB typical
• High gain: 19.5 dB
• High P1dB output power: 16 dBm typical
• Single supply: 3.5 V at 80 mA
• Output IP3: 28 dBm
• 50 Ω matched input/output
• Self biased with optional bias control for quiescent drain control (IDQ) reduction.
• 3 mm × 3 mm, 16-lead LFCSP: 9 mm²


CATALOG
HMC902LP3ETR COUNTRY OF ORIGIN
HMC902LP3ETR PARAMETRIC INFO
HMC902LP3ETR PACKAGE INFO
HMC902LP3ETR MANUFACTURING INFO
HMC902LP3ETR PACKAGING INFO
HMC902LP3ETR ECAD MODELS
HMC902LP3ETR FUNCTIONAL BLOCK DIAGRAM
HMC902LP3ETR APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
Korea (Republic of)


PARAMETRIC INFO
Manufacturer Type Low Noise Amplifier
Number of Channels per Chip 1
Typical Power Gain (dB) 19.5@11000MHz
Typical Noise Figure (dB) 1.8@11000MHz
Process Technology GaAs pHEMT
Operational Bias Conditions 3.5V/80mA
Typical Output 1dB Compressed Power @ Bias Conditions (dBm) 16
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm) 28
Typical Output Intercept Point (dBm) 28@11000MHz
Minimum Operating Frequency (MHz) 5000
Maximum Power Dissipation (mW) 450
Maximum Operating Frequency (MHz) 11000
Typical Output Power (dBm) 16@11000MHz
Typical Output Power Range (dBm) 15 to 20
Maximum Input Return Loss (dB) 12(Typ)@11000MHz
Maximum Output Return Loss (dB) 15(Typ)@11000MHz
Power Supply Type Single
Typical Single Supply Voltage (V) 3.5
Maximum Single Supply Voltage (V) 4.5
Maximum Operating Supply Voltage (V) 4.5
Maximum Supply Current (mA) 110@3.5V
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package LFCSP EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 16
Lead Shape No Lead
PCB 16
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 3
Package Width (mm) 3
Package Height (mm) 0.88
Package Diameter (mm) N/R
Package Overall Length (mm) 3
Package Overall Width (mm) 3
Package Overall Height (mm) 0.9
Seated Plane Height (mm) 0.9
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Lead Frame Chip Scale Package, Exposed Pad
Package Family Name CSP
Jedec MO-220VEED-4
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 500
Reel Diameter (in) 13
Packaging Document Link to Datasheet


ECAD MODELS



FUNCTIONAL BLOCK DIAGRAM



APPLICATIONS
• Point to point radios
• Point to multi point radios
• Military and space
• Test instrumentation

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