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• Small size
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• Industry-standard footprint
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• Compatible with IR solder
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• Diffused optics
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• Operating temperature range of –40°C to +85°C
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• Right angle and reverse mount package available
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• Various colors available
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• Available in 8-mm tape on 7-in. (178-mm) diameter reels
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| CATALOG |
HSMG-C170 COUNTRY OF ORIGIN
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HSMG-C170 PARAMETRIC INFO
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HSMG-C170 PACKAGE INFO
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HSMG-C170 MANUFACTURING INFO
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HSMG-C170 PACKAGING INFO
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HSMG-C170 ECAD MODELS
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HSMG-C170 APPLICATIONS
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COUNTRY OF ORIGIN
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China
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Type |
Uni-Color |
| Color |
Green |
| Category |
Chip LED |
| Mounting Orientation |
Top Mount |
| Lens Shape Type |
Rectangular |
| LED Material |
AlInGaP |
| Lead Standoff |
No |
| High Brightness |
No |
| Peak Wavelength (nm) |
570 |
| Dominant Wavelength (nm) |
572 |
| Intensity |
15mcd |
| Supplier Color |
Green |
| Test Current (mA) |
20 |
| Number of LEDs |
1 |
| Viewing Angle (°) |
170 |
| Lens Appearance |
Diffused |
| High Power |
No |
| Maximum Forward Voltage (V) |
2.6 |
| Maximum Forward Current (mA) |
20 |
| Reverse Voltage (V) |
5(Max) |
| Maximum Power Dissipation (mW) |
52 |
| Minimum Forward Voltage (V) |
1.6 |
| Typical Forward Voltage (V) |
2.2 |
| Internal Protection |
No |
| Maximum Junction Temperature (°C) |
95 |
| Lens Dimensions (mm) |
1.4x1.25x0.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Capacitance Value (pF) |
9 |
| Peak Wavelength Range (nm) |
500 to 600 |
| Maximum Forward Voltage Range (V) |
1.8 to 3.3 |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
85 |
| Thermal Resistance |
250°C/W |
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PACKAGE INFO
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| Supplier Package |
Chip LED |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
No Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
2 |
| Package Width (mm) |
1.25 |
| Package Height (mm) |
0.8 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.8 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
N/A |
| Package Description |
Surface Mount Device |
| Package Family Name |
SMD |
| Jedec |
N/A |
| Package Outline |
Link to Datasheet |
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|
MANUFACTURING INFO
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| MSL |
2a |
| Maximum Reflow Temperature (°C) |
255 to 260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
2 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
N/R |
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PACKAGING INFO
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| Packaging |
Tape and Reel |
| Quantity Of Packaging |
4000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Feed Hole Pitch (mm) |
4 |
| Hole Center to Component Center (mm) |
2 |
| Component Orientation |
Cathode At Sprocket Hole |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Keypad backlighting
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| • Push-button backlighting |
• LCD backlighting
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• Symbol backlighting
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• Front-panel indicator
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