 |
|
| • Small size |
| • Industry-standard footprint |
| • Compatible with IR solder |
| • Diffused optics |
| • Operating temperature range of –40°C to +85°C |
| • Right angle and reverse mount package available |
| • Various colors available |
| • Available in 8-mm tape on 7-in. (178-mm) diameter
reels |
|
| CATALOG |
| HSMH-C190 COUNTRY OF ORIGIN |
| HSMH-C190 LIFECYCLE |
| HSMH-C190 PARAMETRIC INFO |
| HSMH-C190 PACKAGE INFO |
| HSMH-C190 MANUFACTURING INFO |
| HSMH-C190 PACKAGING INFO |
| HSMH-C190 ECAD MODELS |
| HSMH-C190 APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
| Taiwan (Province of China) |
|
| LIFECYCLE |
Obsolete
Jul 28,2022 |
|
| PARAMETRIC INFO |
| Type |
Uni-Color |
| Color |
Red |
| Category |
Chip LED |
| Mounting Orientation |
Top Mount |
| Lens Shape Type |
Rectangular |
| LED Material |
AlGaAs |
| Lead Standoff |
No |
| High Brightness |
No |
| Peak Wavelength (nm) |
660 |
| Dominant Wavelength (nm) |
639 |
| Supplier Color |
Red |
| Test Current (mA) |
20 |
| Intensity |
17mcd |
| Number of LEDs |
1 |
| Viewing Angle (°) |
170 |
| Lens Appearance |
Diffused |
| High Power |
No |
| Maximum Forward Voltage (V) |
2.6 |
| Maximum Forward Current (mA) |
25 |
| Reverse Voltage (V) |
5(Max) |
| Maximum Power Dissipation (mW) |
52 |
| Lens Dimensions (mm) |
1x0.8x0.5 |
| Minimum Forward Voltage (V) |
1.6 |
| Typical Forward Voltage (V) |
2.1 |
| Internal Protection |
No |
| Maximum Junction Temperature (°C) |
95 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Capacitance Value (pF) |
18 |
| Peak Wavelength Range (nm) |
600 to 700 |
| Maximum Forward Voltage Range (V) |
1.8 to 3.3 |
| Minimum Storage Temperature (°C) |
0 |
| Maximum Storage Temperature (°C) |
85 |
| Thermal Resistance |
300°C/W |
|
| |
| PACKAGE INFO |
| Supplier Package |
Chip LED |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
2 |
| Lead Shape |
No Lead |
| PCB |
2 |
| Tab |
N/R |
| Pin Pitch (mm) |
N/R |
| Package Length (mm) |
1.6 |
| Package Width (mm) |
0.8 |
| Package Height (mm) |
0.8 |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.8 |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
N/A |
| Package Description |
Surface Mount Device |
| Package Family Name |
Chip LED |
| Jedec |
N/A |
|
| |
| MANUFACTURING INFO |
| MSL |
2a |
| Maximum Reflow Temperature (°C) |
255 to 260 |
| Reflow Solder Time (Sec) |
10 |
| Number of Reflow Cycle |
2 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
4000 |
| Reel Diameter (in) |
7 |
| Tape Width (mm) |
8 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| • Keypad backlighting |
| • Push-button backlighting |
| • LCD backlighting |
| • Symbol backlighting |
| • Front-panel indicator |
|
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