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• Lowest height (3.0 mm) in this package footprint
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• Shielded construction
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• Excellent DC/DC energy storage up to 5 MHz. Filter inductor applications up to SRF (see“Standard Electrical Specifications” table)
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• Lowest DCR/μH, in this package size
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• Handles high transient current spikes without saturation
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• Ultra low buzz noise, due to composite construction
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| CATALOG |
IHLP2525CZER3R3M01 COUNTRY OF ORIGIN
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IHLP2525CZER3R3M01 PARAMETRIC INFO
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IHLP2525CZER3R3M01 PACKAGE INFO
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IHLP2525CZER3R3M01 MANUFACTURING INFO
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IHLP2525CZER3R3M01 PACKAGING INFO
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IHLP2525CZER3R3M01 ECAD MODELS
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IHLP2525CZER3R3M01 APPLICATIONS
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COUNTRY OF ORIGIN
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China
|
United States of America
|
Israel
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PARAMETRIC INFO
|
| Type |
Power Choke |
| Technology |
Wirewound |
| Protection Style |
Shielded |
| Core Material |
Powdered Iron |
| Inductance (H) |
3.3u |
| Tolerance |
20% |
| Inductance Test Frequency (Hz) |
100K |
| Maximum DC Current (A) |
6(Typ) |
| Typical Temperature Rise (°C) |
40 |
| Maximum Saturation Current (A) |
13.5(Typ) |
| Inductance Decrease Percentage @ Isat (%) |
20 |
| Maximum DC Resistance (Ohm) |
0.03 |
| Minimum Self Resonant Frequency (Hz) |
30M(Typ) |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Operating Temperature (°C) |
-55 |
| Operating Temperature (°C) |
-55 to 125 |
| Polarity |
No |
| Maximum Terminal Width (mm) |
1.57 |
| Voltage Rating |
75V |
|
|
PACKAGE INFO
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| Case Size |
2525 |
| Maximum Product Length (mm) |
7.24 |
| Maximum Product Depth (mm) |
6.72 |
| Maximum Product Height (mm) |
3 |
| Maximum Product Diameter (mm) |
N/R |
| Number of Terminals |
2 |
| Product Weight (g) |
0.8 |
| Package Shape |
Rectangular |
| Terminal Pitch (mm) |
N/R |
| Mounting |
Surface Mount |
| Package Type |
SMD |
| Product Length (mm) |
6.86 |
| Product Depth (mm) |
6.47 |
| Product Height (mm) |
N/A |
| Product Diameter (mm) |
N/R |
|
|
MANUFACTURING INFO
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| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
N/A |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
260 |
| Wave Solder Time (Sec) |
20 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/A |
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PACKAGING INFO
|
| Packaging Suffix |
ER |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
16 |
| Packaging Document |
Link to Datasheet |
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| ECAD MODELS |
 |
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| APPLICATIONS |
| • PDA / notebook / desktop / server applications |
| • High current POL converters |
| • Low profile, high current power supplies |
| • Battery powered devices |
| • DC/DC converters in distributed power systems |
| • DC/DC converter for field programmable gate array (FPGA) |
| |
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