|
|
• FET INPUT: IB = 20pA max
|
• HIGH SPEED: TS = 4µs (G = 100, 0.01%)
|
• LOW OFFSET VOLTAGE: 500µV max
|
• LOW OFFSET VOLTAGE DRIFT:
5µV/°C max
|
• HIGH COMMON-MODE REJECTION:
106dB min
|
| • 8-PIN PLASTIC DIP, SOL-16 SOIC |
|
| CATALOG |
INA111BP COUNTRY OF ORIGIN
|
INA111BP PARAMETRIC INFO
|
INA111BP PACKAGE INFO
|
INA111BP MANUFACTURING INFO
|
INA111BP PACKAGING INFO
|
INA111BP ECAD MODELS
|
INA111BP APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
Philippines
|
| Taiwan (Province of China) |
| Mexico |
|
PARAMETRIC INFO
|
| Number of Channels per Chip |
1 |
| Maximum Input Bias Current (uA) |
0.00002@±15V |
| Minimum CMRR (dB) |
80 |
| Maximum Quiescent Current (mA) |
4.5@±15V |
| Minimum CMRR Range (dB) |
75 to 85 |
| Minimum Dual Supply Voltage (V) |
±6 |
| Maximum Input Resistance (MOhm) |
10000000(Typ)@±15V |
| Maximum Dual Supply Voltage (V) |
±18 |
| Maximum Voltage Gain Range (dB) |
75 to 100 |
| Maximum Voltage Gain (dB) |
80(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
125 |
| Power Supply Type |
Dual |
| Maximum Supply Voltage Range (V) |
30 to 50 |
| Typical Dual Supply Voltage (V) |
±15 |
| Maximum Operating Supply Voltage (V) |
±18 |
|
|
PACKAGE INFO
|
| Supplier Package |
PDIP |
| Basic Package Type |
Through Hole |
| Pin Count |
8 |
| Lead Shape |
Through Hole |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
10.16(Max) |
| Package Width (mm) |
6.6(Max) |
| Package Height (mm) |
5.08(Max) - 0.51(Min) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10.16(Max) |
| Package Overall Width (mm) |
10.92(Max) |
| Package Overall Height (mm) |
5.08(Max) |
| Seated Plane Height (mm) |
5.08(Max) |
| Mounting |
Through Hole |
| Package Material |
Plastic |
| Package Description |
Plastic Dual In Line Package |
| Package Family Name |
DIP |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
N/R |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Maximum Wave Temperature (°C) |
N/A |
| Wave Solder Time (Sec) |
N/A |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
50 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• MEDICAL INSTRUMENTATION
|
| • DATA ACQUISITION |
|
| |
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