
|
|
• COMMON-MODE INPUT RANGE:
±200V (VS = ±15V)
|
• PROTECTED INPUTS:
±500V Common-Mode
±500V Differential
|
• UNITY GAIN: 0.02% Gain Error max
|
• NONLINEARITY: 0.001% max
|
• CMRR: 86dB min
|
|
| CATALOG |
INA117KU/2K5 COUNTRY OF ORIGIN
|
INA117KU/2K5 PARAMETRIC INFO
|
INA117KU/2K5 PACKAGE INFO
|
INA117KU/2K5 MANUFACTURING INFO
|
INA117KU/2K5 PACKAGING INFO
|
INA117KU/2K5 ECAD MODELS
|
INA117KU/2K5 APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Malaysia
|
Thailand
|
Philippines
|
Taiwan (Province of China)
|
China
|
Japan
|
United States of America
|
|
PARAMETRIC INFO
|
| Type |
Differential Amplifier |
| Number of Elements per Chip |
1 |
| Number of Channels per Chip |
1 |
| Maximum Input Offset Voltage (mV) |
2@±15V |
| Minimum CMRR (dB) |
66 |
| Maximum Quiescent Current (mA) |
2@±15V |
| Minimum CMRR Range (dB) |
60 to 75 |
| Maximum Input Resistance (MOhm) |
0.8(Typ)@±15V |
| Maximum Voltage Gain Range (dB) |
<35 |
| Maximum Voltage Gain (dB) |
0(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
85 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
125 |
| Power Supply Type |
Dual |
| Maximum Supply Voltage Range (V) |
30 to 50 |
| Minimum Dual Supply Voltage (V) |
±5 |
| Typical Dual Supply Voltage (V) |
±15 |
| Maximum Dual Supply Voltage (V) |
±18 |
| Maximum Operating Supply Voltage (V) |
±18 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Suffix |
2K5 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|

|
|
APPLICATIONS
|
• CURRENT MONITOR
|
| • BATTERY CELL-VOLTAGE MONITOR |
• GROUND BREAKER
|
• INPUT PROTECTION
|
| • SIGNAL ACQUISITION IN NOISY
ENVIRONMENTS |
| • FACTORY AUTOMATION |
|
| |