INA117KU/2K5 Texas Instruments High Common-Mode Voltage DIFFERENCE AMPLIFIER

label:
2023/12/12 355



• COMMON-MODE INPUT RANGE: ±200V (VS = ±15V)
• PROTECTED INPUTS: ±500V Common-Mode ±500V Differential
• UNITY GAIN: 0.02% Gain Error max
• NONLINEARITY: 0.001% max
• CMRR: 86dB min


CATALOG
INA117KU/2K5 COUNTRY OF ORIGIN
INA117KU/2K5 PARAMETRIC INFO
INA117KU/2K5 PACKAGE INFO
INA117KU/2K5 MANUFACTURING INFO
INA117KU/2K5 PACKAGING INFO
INA117KU/2K5 ECAD MODELS
INA117KU/2K5 APPLICATIONS


COUNTRY OF ORIGIN
Malaysia
Thailand
Philippines
Taiwan (Province of China)
China
Japan
United States of America


PARAMETRIC INFO
Type Differential Amplifier
Number of Elements per Chip 1
Number of Channels per Chip 1
Maximum Input Offset Voltage (mV) 2@±15V
Minimum CMRR (dB) 66
Maximum Quiescent Current (mA) 2@±15V
Minimum CMRR Range (dB) 60 to 75
Maximum Input Resistance (MOhm) 0.8(Typ)@±15V
Maximum Voltage Gain Range (dB) <35
Maximum Voltage Gain (dB) 0(Typ)
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 125
Power Supply Type Dual
Maximum Supply Voltage Range (V) 30 to 50
Minimum Dual Supply Voltage (V) ±5
Typical Dual Supply Voltage (V) ±15
Maximum Dual Supply Voltage (V) ±18
Maximum Operating Supply Voltage (V) ±18


PACKAGE INFO
Supplier Package SOIC
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 3.98(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.19(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 3
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy


PACKAGING INFO
Packaging Suffix 2K5
Packaging Tape and Reel
Quantity Of Packaging 2500
Reel Diameter (in) 13
Tape Pitch (mm) 8
Tape Width (mm) 12
Component Orientation Q1
Packaging Document Link to Datasheet


ECAD MODELS



APPLICATIONS
• CURRENT MONITOR
• BATTERY CELL-VOLTAGE MONITOR
• GROUND BREAKER
• INPUT PROTECTION
• SIGNAL ACQUISITION IN NOISY ENVIRONMENTS
• FACTORY AUTOMATION
Продукт RFQ