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■ A newer version of this device is now available:
INA818
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■ Low offset voltage: 50 µV, maximum
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■ Low drift: 0.5 µV/°C, maximum
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■ Low input bias current: 5 nA, maximum
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■ High CMR: 110 dB, minimum
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■ Inputs protected to ±40 V
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■ Wide supply range: ±2.25 to ±18 V
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■ Low quiescent current: 350 µA
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■ Packages: 8-Pin plastic DIP, SO-8
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| CATALOG |
| INA118U COUNTRY OF ORIGIN |
INA118U PARAMETRIC INFO
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INA118U PACKAGE INFO
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INA118U MANUFACTURING INFO
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| INA118U PACKAGING INFO
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INA118U ECAD MODELS
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INA118U APPLICATIONS
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COUNTRY OF ORIGIN
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| Malaysia |
Philippines
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Taiwan (Province of China)
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PARAMETRIC INFO
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| Number of Channels per Chip |
1 |
| Maximum Input Bias Current (uA) |
0.01@±15V |
| Minimum CMRR (dB) |
73 |
| Maximum Quiescent Current (mA) |
0.385@±15V |
| Minimum CMRR Range (dB) |
60 to 75 |
| Minimum Dual Supply Voltage (V) |
±2.25 |
| Maximum Input Resistance (MOhm) |
10000(Typ)@±15V |
| Maximum Dual Supply Voltage (V) |
±18 |
| Maximum Voltage Gain Range (dB) |
75 to 100 |
| Typical Slew Rate (V/us) |
0.9@±15V |
| Typical Input Offset Current (uA) |
0.001@±15V |
| Maximum Input Offset Current (uA) |
0.01@±15V |
| Maximum Voltage Gain (dB) |
80 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Military |
| Minimum Storage Temperature (°C) |
-40 |
| Maximum Storage Temperature (°C) |
125 |
| Power Supply Type |
Dual |
| Maximum Supply Voltage Range (V) |
30 to 50 |
| Typical Dual Supply Voltage (V) |
±15 |
| Maximum Operating Supply Voltage (V) |
±18 |
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PACKAGE INFO
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| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
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MANUFACTURING INFO
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| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
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PACKAGING INFO
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| Packaging |
Tube |
| Quantity Of Packaging |
75 |
| Packaging Document |
Link to Datasheet |
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ECAD MODELS
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APPLICATIONS
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• Pressure transmitter
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• Temperature transmitter
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• Weigh scale
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• Electrocardiogram (ECG)
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| • Analog input module |
• Data acquisition (DAQ)
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