INA126PA Texas Instruments INAx126 MicroPower Instrumentation Amplifiers

label:

2023/11/23 384

• Low quiescent current: 175 μA/channel

• Wide supply range: ±1.35 V to ±18 V

• Low offset voltage: 250-μV maximum

• Low offset drift: 3-μV/°C maximum

• Low noise: 35 nV/√Hz

• Low input bias current: 25-nA maximum

• Temperature range: –40°C to +85°C

• Multiple package options: – Single channel: • INA126P/PA 8-pin PDIP (P) • INA126U/UA 8-pin SOIC (D) • INA126E/EA 8-pin VSSOP (DGK) – Dual channels: • INA2126P/PA 16-pin PDIP (N) • INA2126U/UA 16-pin SOIC (D) • INA2126E/EA 16-pin SSOP (DBQ)

CATALOG

INA126PA COUNTRY OF ORIGIN

INA126PA PARAMETRIC INFO

INA126PA PACKAGE INFO

INA126PA MANUFACTURING INFO

INA126PA PACKAGING INFO

INA126PA ECAD MODELS

INA126PA APPLICATIONS

COUNTRY OF ORIGIN

Thailand

PARAMETRIC INFO

Number of Channels per Chip	1
Minimum PSRR (dB)	106(Typ)
Maximum Input Offset Voltage (mV)	0.5@±15V
Maximum Input Bias Current (uA)	0.05@±15V
Minimum CMRR (dB)	74
Maximum Quiescent Current (mA)	0.2@±15V
Minimum CMRR Range (dB)	60 to 75
Minimum Single Supply Voltage (V)	2.7
Maximum Single Supply Voltage (V)	36
Minimum Dual Supply Voltage (V)	±1.35
Maximum Input Resistance (MOhm)	1000(Typ)@±15V
Maximum Dual Supply Voltage (V)	±18
Maximum Voltage Gain Range (dB)	75 to 100
Typical Slew Rate (V/us)	0.4@±15V
Typical Input Offset Current (uA)	0.0005@±15V
Maximum Input Offset Current (uA)	0.005@±15V
Maximum Voltage Gain (dB)	80(Typ)
Minimum Operating Temperature (°C)	-40
Maximum Operating Temperature (°C)	85
Supplier Temperature Grade	Industrial
Minimum Storage Temperature (°C)	-55
Maximum Storage Temperature (°C)	125
Power Supply Type	Single\|Dual
Maximum Supply Voltage Range (V)	30 to 50
Typical Single Supply Voltage (V)	3\|5\|9\|12\|15\|18\|24\|28
Typical Dual Supply Voltage (V)	±15
Maximum Operating Supply Voltage (V)	±18\|36

PACKAGE INFO

Supplier Package	PDIP
Basic Package Type	Through Hole
Pin Count	8
Lead Shape	Through Hole
PCB	8
Tab	N/R
Pin Pitch (mm)	2.54
Package Length (mm)	10.16(Max)
Package Width (mm)	6.6(Max)
Package Height (mm)	5.08(Max) - 0.51(Min)
Package Diameter (mm)	N/R
Package Overall Length (mm)	10.16(Max)
Package Overall Width (mm)	10.92(Max)
Package Overall Height (mm)	5.08(Max)
Seated Plane Height (mm)	5.08(Max)
Mounting	Through Hole
Package Weight (g)	N/A
Package Material	Plastic
Package Description	Plastic Dual In Line Package
Package Family Name	DIP
Jedec	MS-001BA
Package Outline	Link to Datasheet

MANUFACTURING INFO

MSL	N/R
Maximum Reflow Temperature (°C)	N/R
Reflow Solder Time (Sec)	N/R
Reflow Temp. Source	Link to Datasheet
Maximum Wave Temperature (°C)	N/A
Wave Solder Time (Sec)	N/A
Lead Finish(Plating)	Au
Under Plating Material	Pd over Ni
Terminal Base Material	Cu Alloy

PACKAGING INFO

Packaging	Tube
Quantity Of Packaging	50
Packaging Document	Link to Datasheet

ECAD MODELS

APPLICATIONS

• Level transmitter

• Flow transmitter

• Multiparameter patient monitor

• Mixed module (AI, AO, DI, DO)

• AC charging (pile) station

• Infusion pump

• Electrocardiogram (ECG)