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• Low offset voltage: 50 μV, maximum
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• Low drift: 0.5 μV/°C, maximum
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• Low input bias current: 5 nA, maximum
|
• Low noise: 8 nV/√
Hz, 0.2 μVpp
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• High CMR: 120 dB, minimum
|
• Bandwidth: 1.3 MHz (G = 1)
|
• Inputs protected to ±40 V
|
• Wide supply range: ±2.25 V to ±18 V
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• Low quiescent current: 700 μA
|
• Packages: 8-pin plastic DIP, SO-8
|
|
| CATALOG |
INA128UA/2K5 COUNTRY OF ORIGIN
|
INA128UA/2K5 PARAMETRIC INFO
|
INA128UA/2K5 PACKAGE INFO
|
INA128UA/2K5 MANUFACTURING INFO
|
INA128UA/2K5 PACKAGING INFO
|
INA128UA/2K5 ECAD MODELS
|
INA128UA/2K5 APPLICATIONS
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COUNTRY OF ORIGIN
|
Philippines
|
Malaysia
|
Taiwan (Province of China)
|
Thailand
|
|
PARAMETRIC INFO
|
| Number of Channels per Chip |
1 |
| Maximum Input Offset Voltage (mV) |
0.125@±15V |
| Maximum Input Bias Current (uA) |
0.01@±15V |
| Minimum CMRR (dB) |
73 |
| Maximum Quiescent Current (mA) |
0.75@±15V |
| Minimum CMRR Range (dB) |
60 to 75 |
| Minimum Dual Supply Voltage (V) |
±2.25 |
| Maximum Input Resistance (MOhm) |
100000(Typ)@±15V |
| Maximum Dual Supply Voltage (V) |
±18 |
| Maximum Voltage Gain Range (dB) |
75 to 100 |
| Maximum Voltage Gain (dB) |
80 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
125 |
| Power Supply Type |
Dual |
| Maximum Supply Voltage Range (V) |
30 to 50 |
| Typical Dual Supply Voltage (V) |
±15 |
| Maximum Operating Supply Voltage (V) |
±18 |
|
|
PACKAGE INFO
|
| Supplier Package |
SOIC |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
3.98(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.19(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
3 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
|
PACKAGING INFO
|
| Packaging Suffix |
2K5 |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
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APPLICATIONS
|
• Pressure transmitter
|
| • Temperature transmitter |
| • Weigh scale |
| • Electrocardiogram (ECG) |
• Analog input module
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• Data acquisition (DAQ)
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| |
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