INA193AQDBVRQ1 Texas Instruments IC CURRENT MONITOR 3% SOT23-5

label:
2023/10/30 322


• Qualified for Automotive Applications
• Functional Safety-Capable
   – Documentation available to aid functional safety system design  
• Wide Common-Mode Voltage:
   –16 V to 80 V
• Low Error: 3% Overtemperature (Maximum)
• Bandwidth: Up to 500 kHz
• Three Transfer Functions Available: 20 V/V, 50 V/ V, and 100 V/V
• Complete Current-Sense Solution


CATALOG
INA193AQDBVRQ1 COUNTRY OF ORIGIN
INA193AQDBVRQ1 PARAMETRIC INFO
INA193AQDBVRQ1 PACKAGE INFO
INA193AQDBVRQ1 MANUFACTURING INFO
INA193AQDBVRQ1 PACKAGING INFO
INA193AQDBVRQ1 ECAD MODELS
INA193AQDBVRQ1 FUNCTIONAL BLOCK DIAGRAM  
INA193AQDBVRQ1 APPLICATIONS  


COUNTRY OF ORIGIN
China
Malaysia
Thailand


PARAMETRIC INFO
Type Current Shunt Monitor
Number of Elements per Chip 2
Number of Channels per Chip 1
Maximum Input Offset Voltage (mV) 2@12V
Maximum Input Bias Current (uA) 23@12V@-40C to 125C
Minimum CMRR (dB) 80
Maximum Quiescent Current (mA) 0.95@12V@-40C to 125C
Minimum CMRR Range (dB) 75 to 85
Maximum Voltage Gain Range (dB) <35
Maximum Voltage Gain (dB) 26.02(Typ)
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Supplier Temperature Grade Extended
Minimum Storage Temperature (°C) -65
Maximum Storage Temperature (°C) 150
Power Supply Type Single
Maximum Supply Voltage Range (V) 18 to 20
Minimum Single Supply Voltage (V) 2.7
Typical Single Supply Voltage (V) 3|5|9|12|15
Maximum Single Supply Voltage (V) 18
Maximum Operating Supply Voltage (V) 18
 
PACKAGE INFO
Supplier Package SOT-23
Basic Package Type Lead-Frame SMT
Pin Count 5
Lead Shape Gull-wing
PCB 5
Tab N/R
Pin Pitch (mm) 0.95
Package Length (mm) 3.05(Max)
Package Width (mm) 1.75(Max)
Package Height (mm) 1.1
Package Diameter (mm) N/R
Package Overall Length (mm) 3.05(Max)
Package Overall Width (mm) 3(Max)
Package Overall Height (mm) 1.45(Max)
Seated Plane Height (mm) 1.45(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline Transistor
Package Family Name SOT
Jedec MO-178AA
Package Outline Link to Datasheet
 
MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Au
Under Plating Material Pd over Ni
Terminal Base Material Cu Alloy
 
PACKAGING INFO
Packaging Suffix R
Packaging Tape and Reel
Quantity Of Packaging 3000
Reel Diameter (in) 7
Tape Pitch (mm) 4
Tape Width (mm) 8
Component Orientation Q3
Packaging Document Link to Datasheet
 
ECAD MODELS

 
FUNCTIONAL BLOCK DIAGRAM  


APPLICATIONS
• Welding Equipment
• Body Control Modules
• Load Health Monitoring
• Telecom Equipment
• HEV/EV Powertrain
• Power Management
• Battery Chargers


Продукт RFQ