 |
|
| • Updated format to match new TI layout and flow.
Tables, figures and cross-references use a new
numbering sequence throughout the document.Wide Common-Mode Range: –0.3 V to 26 V
|
| • Offset Voltage: ±35 μV (Maximum, INA210)
(Enables Shunt Drops of 10-mV Full-Scale)
|
• Accuracy:
– Gain Error (Maximum Over Temperature):
• ±0.5% (Version C)
• ±1% (Versions A and B)
– 0.5-µV/°C Offset Drift (Maximum)
– 10-ppm/°C Gain Drift (Maximum)
|
• Choice of Gains:
– INA210: 200 V/V
– INA211: 500 V/V
– INA212: 1000 V/V
– INA213: 50 V/V
– INA214: 100 V/V
– INA215: 75 V/V |
| • Quiescent Current: 100 μA (Maximum)
|
| • SC70 and Thin UQFN Packages: All Models |
|
| CATALOG |
| INA213AIDCKR COUNTRY OF ORIGIN |
| INA213AIDCKR PARAMETRIC INFO |
| INA213AIDCKR PACKAGE INFO |
| INA213AIDCKR MANUFACTURING INFO |
| INA213AIDCKR PACKAGING INFO |
| INA213AIDCKR ECAD MODELS |
| INA213AIDCKR FUNCTIONAL BLOCK DIAGRAM |
| INA213AIDCKR APPLICATIONS
|
|
| COUNTRY OF ORIGIN |
| China |
| Malaysia |
| Thailand |
|
| PARAMETRIC INFO |
| Type |
Current Shunt Monitor |
| Number of Elements per Chip |
1 |
| Number of Channels per Chip |
1 |
| Minimum PSRR (dB) |
140(Typ) |
| Maximum Input Offset Voltage (mV) |
0.1@5V |
| Maximum Input Bias Current (uA) |
35@5V |
| Minimum CMRR (dB) |
100 |
| Maximum Quiescent Current (mA) |
0.1@5V |
| Minimum CMRR Range (dB) |
95 to 105 |
| Maximum Voltage Gain Range (dB) |
<35 |
| Maximum Voltage Gain (dB) |
33.98(Typ) |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Supplier Temperature Grade |
Extended |
| Minimum Storage Temperature (°C) |
-65 |
| Maximum Storage Temperature (°C) |
150 |
| Power Supply Type |
Single |
| Maximum Supply Voltage Range (V) |
20 to 30 |
| Minimum Single Supply Voltage (V) |
2.7 |
| Typical Single Supply Voltage (V) |
5 |
| Maximum Single Supply Voltage (V) |
26 |
| Maximum Operating Supply Voltage (V) |
26 |
|
| |
| PACKAGE INFO |
| Supplier Package |
SC-70 |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
6 |
| Lead Shape |
Gull-wing |
| PCB |
6 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
2.15(Max) |
| Package Width (mm) |
1.4(Max) |
| Package Height (mm) |
1(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
2.15(Max) |
| Package Overall Width (mm) |
2.4(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline Transistor |
| Package Family Name |
SOT |
| Jedec |
MO-203AB |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn|Au |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
3000 |
| Reel Diameter (in) |
7 |
| Reel Width (mm) |
8.4|9 |
| Tape Pitch (mm) |
4 |
| Tape Width (mm) |
8 |
| Component Orientation |
Q3 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS
|
| • Notebook Computers |
| • Cell Phones |
| • Telecom Equipment |
| • Power Management |
| • Battery Chargers |
| |
| |
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