 |
|
| • Senses Bus Voltages From 0 V to 36 V |
| • High-Side or Low-Side Sensing |
| • Reports Current, Voltage, and Power |
• High Accuracy:
– 0.1% Gain Error (Max)
– 10 μV Offset (Max) |
| • Configurable Averaging Options |
| • 16 Programmable Addresses |
| • Operates from 2.7-V to 5.5-V Power Supply |
| • 10-Pin, DGS (VSSOP) Package |
|
| CATALOG |
| INA226AIDGSR COUNTRY OF ORIGIN |
| INA226AIDGSR PARAMETRIC INFO |
| INA226AIDGSR PACKAGE INFO |
| INA226AIDGSR MANUFACTURING INFO |
| INA226AIDGSR PACKAGING INFO |
| INA226AIDGSR ECAD MODELS |
| INA226AIDGSR FUNCTIONAL BLOCK DIAGRAM |
| INA226AIDGSR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| China |
|
| PARAMETRIC INFO |
| Type |
Monitor |
| Input Voltage (V) |
2.7 to 5.5 |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Minimum Operating Supply Voltage (V) |
2.7 |
| Typical Operating Supply Voltage (V) |
3.3 |
| Maximum Operating Supply Voltage (V) |
5.5 |
| Output Current (A) |
0.01(Max) |
| Maximum Storage Temperature (°C) |
150 |
| Minimum Storage Temperature (°C) |
-65 |
|
| |
| PACKAGE INFO |
| Supplier Package |
VSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
10 |
| Lead Shape |
Gull-wing |
| PCB |
10 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187BA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn|AuAg |
| Under Plating Material |
N/A|Pd over Ni |
| Terminal Base Material |
Cu Alloy |
| Number of Wave Cycles |
N/R |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Reel Width (mm) |
12.4 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| FUNCTIONAL BLOCK DIAGRAM |
 |
|
| APPLICATIONS |
| • Servers |
| • Telecom Equipment |
| • Computing |
| • Power Management |
| • Battery Chargers |
| • Power Supplies |
| • Test Equipment |
|
One-stop supplier of IC products