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| ● DESIGNED FOR LOW COST |
| ● HIGH GAIN ACCURACY: G = 5, 0.07%, 2ppm/°C |
| ● GAIN SET WITH EXT. RESISTORS FOR > 5V/V |
| ● HIGH CMRR: 73dB DC, 50dB at 45kHz |
| ● LOW BIAS CURRENT: 0.5pA |
| ● BANDWIDTH, SLEW RATE: 2.0MHz, 5V/µs |
| ● RAIL-TO-RAIL OUTPUT SWING: (V+) – 0.02V |
| ● WIDE TEMPERATURE RANGE: –55°C to +125°C |
| ● LOW QUIESCENT CURRENT: 490µA max/chan |
| ● SHUTDOWN: 0.01µA |
| ● MSOP-8 SINGLE AND TSSOP-14 DUAL PACKAGES |
|
| CATALOG |
| INA332AIDGKR COUNTRY OF ORIGIN |
| INA332AIDGKR PARAMETRIC INFO |
| INA332AIDGKR PACKAGE INFO |
| INA332AIDGKR MANUFACTURING INFO |
| INA332AIDGKR PACKAGING INFO |
| INA332AIDGKR ECAD MODELS |
| INA332AIDGKR APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Thailand |
| China |
| Malaysia |
|
| PARAMETRIC INFO |
| Rail to Rail |
Rail to Rail Output |
| Number of Channels per Chip |
1 |
| Minimum PSRR (dB) |
86.02(Typ) |
| Maximum Input Offset Voltage (mV) |
8@5V |
| Maximum Input Bias Current (uA) |
0.00001@5.5V |
| Minimum CMRR (dB) |
60 |
| Maximum Quiescent Current (mA) |
0.49@5.5V |
| Minimum CMRR Range (dB) |
60 to 75 |
| Minimum Single Supply Voltage (V) |
2.5 |
| Maximum Single Supply Voltage (V) |
5.5 |
| Maximum Input Resistance (MOhm) |
10000000(Typ)@5.5V |
| Maximum Voltage Gain Range (dB) |
60 to 75 |
| Maximum Voltage Gain (dB) |
60 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
125 |
| Power Supply Type |
Single |
| Maximum Supply Voltage Range (V) |
5 to 7 |
| Typical Single Supply Voltage (V) |
3|5 |
| Maximum Operating Supply Voltage (V) |
5.5 |
|
| |
| PACKAGE INFO |
| Supplier Package |
VSSOP |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.65 |
| Package Length (mm) |
3.1(Max) |
| Package Width (mm) |
3.1(Max) |
| Package Height (mm) |
0.95(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
3.1(Max) |
| Package Overall Width (mm) |
5.05(Max) |
| Package Overall Height (mm) |
1.1(Max) |
| Seated Plane Height (mm) |
1.1(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Very Thin Shrink Small Outline Package |
| Package Family Name |
SO |
| Jedec |
MO-187AA |
| Package Outline |
Link to Datasheet |
|
| |
| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
PdNiAg |
| Terminal Base Material |
Cu Alloy |
|
| |
| PACKAGING INFO |
| Packaging Suffix |
R |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
| Reel Diameter (in) |
13 |
| Tape Pitch (mm) |
8 |
| Tape Width (mm) |
12 |
| Component Orientation |
Q1 |
| Packaging Document |
Link to Datasheet |
|
| |
| ECAD MODELS |
 |
|
| APPLICATIONS |
| ● INDUSTRIAL SENSOR AMPLIFIERS:
Bridge, RTD, Thermocouple, Position |
| ● PHYSIOLOGICAL AMPLIFIERS: ECG, EEG, EMG |
| ● A/D CONVERTER SIGNAL CONDITIONING |
| ● DIFFERENTIAL LINE RECEIVERS WITH GAIN |
| ● FIELD UTILITY METERS |
| ● PCMCIA CARDS |
| ● AUDIO AMPLIFIERS |
| ● COMMUNICATION SYSTEMS |
| ● TEST EQUIPMENT |
| ● AUTOMOTIVE INSTRUMENTATION |
| |
| |
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