|
|
• HDMI 2.0 and all backward compatible standards are supported
|
• 6.0 Gbps TMDS Bit Rate (600 Mcsc TMDS Character Rate) compatible
|
• Supports UHD 4k (2160p) 60 Hz display modes
|
• Impedance matched 100 differential transmission line ESD protection for
TMDS lines (10 ). No Printed-Circuit Board (PCB) pre-compensation required
|
• CEC buffering and isolation, with integrated backdrive-protected 26 k pull-up
|
| • Simplified flow-through routing utilizing less overall PCB space |
| • DDC capacitive decoupling between system side and HDMI connector side and
buffering to drive cable with high capacitive load (> 700 pF/25 m) |
| • All external I/O lines with ESD protection of at least 12 kV, exceeding the
IEC 61000-4-2, level 4 standard |
| • Hot plug detect module |
| • Robust ESD protection without degradation after repeated ESD strikes |
|
| CATALOG |
IP4786CZ32Y COUNTRY OF ORIGIN
|
| IP4786CZ32Y LIFECYCLE |
IP4786CZ32Y PARAMETRIC INFO
|
IP4786CZ32Y PACKAGE INFO
|
IP4786CZ32Y MANUFACTURING INFO
|
IP4786CZ32Y PACKAGING INFO
|
IP4786CZ32Y ECAD MODELS
|
IP4786CZ32Y APPLICATIONS
|
|
COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
|
| LIFECYCLE |
Obsolete
Dec 31,2020 |
|
PARAMETRIC INFO
|
| Category |
DVI and HDMI interface ESD and Overcurrent Protection |
| Minimum Operating Temperature (°C) |
-25 |
| Maximum Operating Temperature (°C) |
85 |
| Maximum Storage Temperature (°C) |
125 |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Operating Supply Voltage (V) |
6.5 |
| Minimum Operating Supply Voltage (V) |
4.5 |
| Typical Operating Supply Voltage (V) |
5 |
| Maximum Power Dissipation (mW) |
50 |
|
|
PACKAGE INFO
|
| Supplier Package |
HVQFN EP |
| Basic Package Type |
Non-Lead-Frame SMT |
| Pin Count |
32 |
| Lead Shape |
No Lead |
| PCB |
32 |
| Tab |
N/R |
| Pin Pitch (mm) |
0.5 |
| Package Length (mm) |
5.1(Max) |
| Package Width (mm) |
5.1(Max) |
| Package Height (mm) |
0.85 - 0.05(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
0.85 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Thermal Enhanced Very Thin Quad Flat Package, Exposed Pad |
| Package Family Name |
QFN |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Reflow Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Au |
| Under Plating Material |
Pd over Ni |
| Terminal Base Material |
Cu Alloy |
|
|
PACKAGING INFO
|
| Packaging Document |
Link to Datasheet |
|
|
ECAD MODELS
|
|
|
APPLICATIONS
|
• Standard-Definition (SD) and High-Definition (HD) DVD player
|
| • Set-top box |
• PC graphic card
|
| • Game console |
| • HDMI picture performance quality enhancer module |
| • Digital Visual Interface (DVI) |
|
| |
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