|
|
• N-channel - Logic Level - Enhancement mode
|
• Automotive AEC Q101 qualified
|
• MSL1 up to 260°C peak reflow
|
• 175°C operating temperature
|
• Green package (lead free)
|
• Ultra low Rds(on)
|
• 100% Avalanche tested
|
• ESD Class 2 (HBM)EIA/JESD22-A114-B
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|
| CATALOG |
IPB80N06S3L-06 Country of Origin
|
IPB80N06S3L-06 Lifecycle
|
IPB80N06S3L-06 Parametric Info
|
IPB80N06S3L-06 Package Info
|
IPB80N06S3L-06 Manufacturing Info
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|
COUNTRY OF ORIGIN
|
Malaysia
|
|
LIFECYCLE
|
Obsolete
Jan 31,2011
|
|
PARAMETRIC INFO
|
| Channel Type |
N |
| Channel Mode |
Enhancement |
| Configuration |
Single |
| Maximum Drain Source Voltage (V) |
55 |
| Maximum Continuous Drain Current (A) |
80 |
| Maximum Absolute Continuous Drain Current (A) |
80 |
| Maximum Gate Source Voltage (V) |
±16 |
| Maximum Drain Source Resistance (mOhm) |
5.6@10V |
| Typical Gate Charge @ Vgs (nC) |
131@10V |
| Typical Gate Charge @ 10V (nC) |
131 |
| Maximum Power Dissipation (mW) |
136000 |
| Process Technology |
OptiMOS |
| Category |
Power MOSFET |
| Typical Input Capacitance @ Vds (pF) |
9417@25V |
| Typical Turn-On Delay Time (ns) |
20 |
| Typical Turn-Off Delay Time (ns) |
55 |
| Typical Fall Time (ns) |
39 |
| Typical Rise Time (ns) |
43 |
| Number of Elements per Chip |
1 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
175 |
|
|
PACKAGE INFO
|
| Supplier Package |
D2PAK |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
3 |
| Lead Shape |
Gull-wing |
| PCB |
2 |
| Tab |
Tab |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
10 |
| Package Width (mm) |
9.25 |
| Package Height (mm) |
4.4 |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
10 |
| Package Overall Width (mm) |
15 |
| Package Overall Height (mm) |
4.5 |
| Seated Plane Height (mm) |
4.5 |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Double Deca Watt Package |
| Package Family Name |
TO-263 |
| Jedec |
TO-263AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
245 |
| Reflow Solder Time (Sec) |
30 |
| Number of Reflow Cycle |
3 |
| Standard |
J-STD-020D |
| Maximum Wave Temperature (°C) |
N/R |
| Wave Solder Time (Sec) |
N/R |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
Ni |
| Terminal Base Material |
Cu Alloy |
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