IPG20N06S4L26AATMA1 Infineon Technologies MOSFET 2N-CH 8TDSON

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2024/12/6 135
IPG20N06S4L26AATMA1 Infineon Technologies 	MOSFET 2N-CH 8TDSON


• Dual N-channel Logic Level - Enhancement mode
• AEC Q101 qualified
• MSL1 up to 260°C peak reflow
• 175°C operating temperature
• Green Product (RoHS compliant)
• 100% Avalanche tested
• Feasible for automatic optical inspection (AOI)


CATALOG
IPG20N06S4L26AATMA1 COUNTRY OF ORIGIN
IPG20N06S4L26AATMA1 PARAMETRIC INFO
IPG20N06S4L26AATMA1 PACKAGE INFO
IPG20N06S4L26AATMA1 MANUFACTURING INFO
IPG20N06S4L26AATMA1 PACKAGING INFO


COUNTRY OF ORIGIN
China
Malaysia
Austria


PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Dual Dual Drain
Maximum Drain Source Voltage (V) 60
Maximum Absolute Continuous Drain Current (A) 20
Maximum Continuous Drain Current (A) 20
Maximum Gate Source Voltage (V) ±16
Maximum Drain Source Resistance (mOhm) 26@10V
Typical Gate Charge @ Vgs (nC) 15@10V
Typical Gate Charge @ 10V (nC) 15
Maximum Power Dissipation (mW) 33000
Process Technology OptiMOS
Category Power MOSFET
Maximum Junction Case Thermal Resistance 4.5K/W
Typical Input Capacitance @ Vds (pF) 1100@25V
Typical Turn-On Delay Time (ns) 5
Typical Turn-Off Delay Time (ns) 18
Typical Fall Time (ns) 10
Typical Rise Time (ns) 1.5
Maximum Gate Source Leakage Current (nA) 100
Maximum Gate Threshold Voltage (V) 2.2
Maximum IDSS (uA) 1
Number of Elements per Chip 2
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 175
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 175


PACKAGE INFO
Supplier Package TDSON EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 8
Lead Shape No Lead
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5.15
Package Width (mm) 5.9
Package Height (mm) 1
Package Diameter (mm) N/R
Package Overall Length (mm) 5.41
Package Overall Width (mm) 6.45
Package Overall Height (mm) 1
Seated Plane Height (mm) 1
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Family Name SON
Jedec N/A
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material N/A


PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 5000

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