
|
|
• Floating channel designed for bootstrap operation Fully operational to +600V Tolerant to negative transient voltage dV/dt immune
|
• Gate drive supply range from 10 to 20V
|
• Undervoltage lockout
|
• 3.3V, 5V and 15V input logic compatible
|
• Cross-conduction prevention logic
|
• Internally set deadtime
|
• High side output in phase with input
|
• Shut down input turns off both channels
|
• Matched propagation delay for both channels
|
• Also available LEAD-FREE
|
|
CATALOG |
IR2104STRPBF COUNTRY OF ORIGIN
|
IR2104STRPBF PARAMETRIC INFO
|
IR2104STRPBF PACKAGE INFO
|
IR2104STRPBF MANUFACTURING INFO
|
IR2104STRPBF PACKAGING INFO
|
|
COUNTRY OF ORIGIN
|
Thailand
|
China
|
Philippines
|
Taiwan (Province of China)
|
Indonesia
|
Malaysia
|
United States of America
|
|
PARAMETRIC INFO
|
Driver Type |
High and Low Side |
Number of Drivers |
2 |
Bridge Type |
Half Bridge |
Driver Configuration |
Non-Inverting |
Input Logic Compatibility |
CMOS|LSTTL|3.3V(Min)|5V|15V |
Maximum Operating Supply Voltage (V) |
20 |
Peak Output Current (A) |
0.36(Typ) |
Type |
IGBT|MOSFET |
Minimum Operating Temperature (°C) |
-40 |
Maximum Operating Temperature (°C) |
125 |
Maximum Turn-Off Delay Time (ns) |
60 |
Maximum Turn-On Delay Time (ns) |
60 |
High and Low Sides Dependency |
Synchronous |
Process Technology |
CMOS |
Number of Outputs |
2 |
Maximum Power Dissipation (mW) |
625 |
Minimum Operating Supply Voltage (V) |
10 |
Absolute Propagation Delay Time (ns) |
820 |
Maximum Propagation Delay Time (ns) |
820 |
Maximum Rise Time (ns) |
170 |
Maximum Fall Time (ns) |
90 |
Typical Input High Threshold Voltage (V) |
3(Min) |
Typical Input Low Threshold Voltage (V) |
0.8(Max) |
Latch-Up Proof |
No |
Special Features |
Internally Set Deadtime|Undervoltage Lockout |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
150 |
|
|
PACKAGE INFO
|
Supplier Package |
SOIC N |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
8 |
Lead Shape |
Gull-wing |
PCB |
8 |
Tab |
N/R |
Pin Pitch (mm) |
1.27 |
Package Length (mm) |
5(Max) |
Package Width (mm) |
4(Max) |
Package Height (mm) |
1.5(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
5(Max) |
Package Overall Width (mm) |
6.2(Max) |
Package Overall Height (mm) |
1.75(Max) |
Seated Plane Height (mm) |
1.75(Max) |
Mounting |
Surface Mount |
Package Weight (g) |
N/A |
Package Material |
Plastic |
Package Description |
Small Outline IC Narrow Body |
Package Family Name |
SO |
Jedec |
MS-012AA |
Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO |
MSL |
2 |
Maximum Reflow Temperature (°C) |
260 |
Reflow Solder Time (Sec) |
10 to 30 |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
300 |
Wave Solder Time (Sec) |
10 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn annealed |
Under Plating Material |
N/A |
Terminal Base Material |
Cu |
Shelf Life Period |
3 Years |
|
|
PACKAGING INFO |
Packaging Suffix |
TR |
Packaging |
Tape and Reel |
Quantity Of Packaging |
2500 |
|
|