IR2104STRPBF Infineon Technologies IC DRIVER HIGH/LOW SIDE 8SOIC

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2024/07/22 276
IR2104STRPBF Infineon Technologies IC DRIVER HIGH/LOW SIDE 8SOIC


• Floating channel designed for bootstrap operation Fully operational to +600V Tolerant to negative transient voltage dV/dt immune
• Gate drive supply range from 10 to 20V
• Undervoltage lockout
• 3.3V, 5V and 15V input logic compatible
• Cross-conduction prevention logic
• Internally set deadtime
• High side output in phase with input
• Shut down input turns off both channels
• Matched propagation delay for both channels
• Also available LEAD-FREE


CATALOG
IR2104STRPBF COUNTRY OF ORIGIN
IR2104STRPBF PARAMETRIC INFO
IR2104STRPBF PACKAGE INFO
IR2104STRPBF MANUFACTURING INFO
IR2104STRPBF PACKAGING INFO


COUNTRY OF ORIGIN
Thailand
China
Philippines
Taiwan (Province of China)
Indonesia
Malaysia
United States of America


PARAMETRIC INFO
Driver Type High and Low Side
Number of Drivers 2
Bridge Type Half Bridge
Driver Configuration Non-Inverting
Input Logic Compatibility CMOS|LSTTL|3.3V(Min)|5V|15V
Maximum Operating Supply Voltage (V) 20
Peak Output Current (A) 0.36(Typ)
Type IGBT|MOSFET
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 125
Maximum Turn-Off Delay Time (ns) 60
Maximum Turn-On Delay Time (ns) 60
High and Low Sides Dependency Synchronous
Process Technology CMOS
Number of Outputs 2
Maximum Power Dissipation (mW) 625
Minimum Operating Supply Voltage (V) 10
Absolute Propagation Delay Time (ns) 820
Maximum Propagation Delay Time (ns) 820
Maximum Rise Time (ns) 170
Maximum Fall Time (ns) 90
Typical Input High Threshold Voltage (V) 3(Min)
Typical Input Low Threshold Voltage (V) 0.8(Max)
Latch-Up Proof No
Special Features Internally Set Deadtime|Undervoltage Lockout
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 150


PACKAGE INFO
Supplier Package SOIC N
Basic Package Type Lead-Frame SMT
Pin Count 8
Lead Shape Gull-wing
PCB 8
Tab N/R
Pin Pitch (mm) 1.27
Package Length (mm) 5(Max)
Package Width (mm) 4(Max)
Package Height (mm) 1.5(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 5(Max)
Package Overall Width (mm) 6.2(Max)
Package Overall Height (mm) 1.75(Max)
Seated Plane Height (mm) 1.75(Max)
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Small Outline IC Narrow Body
Package Family Name SO
Jedec MS-012AA
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 2
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 10 to 30
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 300
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu
Shelf Life Period 3 Years


PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 2500
Продукт RFQ