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• Floating channel designed for bootstrap operation Fully operational to +600V Tolerant to negative transient voltage dV/dt immune
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• Gate drive supply range from 10 to 20V
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• Undervoltage lockout
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• 3.3V, 5V and 15V input logic compatible
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• Cross-conduction prevention logic
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• Internally set deadtime
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• High side output in phase with input
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• Shut down input turns off both channels
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• Matched propagation delay for both channels
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• Also available LEAD-FREE
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| CATALOG |
IR2104STRPBF COUNTRY OF ORIGIN
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IR2104STRPBF PARAMETRIC INFO
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IR2104STRPBF PACKAGE INFO
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IR2104STRPBF MANUFACTURING INFO
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IR2104STRPBF PACKAGING INFO
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COUNTRY OF ORIGIN
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Thailand
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China
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Philippines
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Taiwan (Province of China)
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Indonesia
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Malaysia
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United States of America
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PARAMETRIC INFO
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| Driver Type |
High and Low Side |
| Number of Drivers |
2 |
| Bridge Type |
Half Bridge |
| Driver Configuration |
Non-Inverting |
| Input Logic Compatibility |
CMOS|LSTTL|3.3V(Min)|5V|15V |
| Maximum Operating Supply Voltage (V) |
20 |
| Peak Output Current (A) |
0.36(Typ) |
| Type |
IGBT|MOSFET |
| Minimum Operating Temperature (°C) |
-40 |
| Maximum Operating Temperature (°C) |
125 |
| Maximum Turn-Off Delay Time (ns) |
60 |
| Maximum Turn-On Delay Time (ns) |
60 |
| High and Low Sides Dependency |
Synchronous |
| Process Technology |
CMOS |
| Number of Outputs |
2 |
| Maximum Power Dissipation (mW) |
625 |
| Minimum Operating Supply Voltage (V) |
10 |
| Absolute Propagation Delay Time (ns) |
820 |
| Maximum Propagation Delay Time (ns) |
820 |
| Maximum Rise Time (ns) |
170 |
| Maximum Fall Time (ns) |
90 |
| Typical Input High Threshold Voltage (V) |
3(Min) |
| Typical Input Low Threshold Voltage (V) |
0.8(Max) |
| Latch-Up Proof |
No |
| Special Features |
Internally Set Deadtime|Undervoltage Lockout |
| Minimum Storage Temperature (°C) |
-55 |
| Maximum Storage Temperature (°C) |
150 |
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PACKAGE INFO
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| Supplier Package |
SOIC N |
| Basic Package Type |
Lead-Frame SMT |
| Pin Count |
8 |
| Lead Shape |
Gull-wing |
| PCB |
8 |
| Tab |
N/R |
| Pin Pitch (mm) |
1.27 |
| Package Length (mm) |
5(Max) |
| Package Width (mm) |
4(Max) |
| Package Height (mm) |
1.5(Max) |
| Package Diameter (mm) |
N/R |
| Package Overall Length (mm) |
5(Max) |
| Package Overall Width (mm) |
6.2(Max) |
| Package Overall Height (mm) |
1.75(Max) |
| Seated Plane Height (mm) |
1.75(Max) |
| Mounting |
Surface Mount |
| Package Weight (g) |
N/A |
| Package Material |
Plastic |
| Package Description |
Small Outline IC Narrow Body |
| Package Family Name |
SO |
| Jedec |
MS-012AA |
| Package Outline |
Link to Datasheet |
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| MANUFACTURING INFO |
| MSL |
2 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 to 30 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
300 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed |
| Under Plating Material |
N/A |
| Terminal Base Material |
Cu |
| Shelf Life Period |
3 Years |
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| PACKAGING INFO |
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2500 |
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