IRF3205STRLPBF Infineon Technologies MOSFET N-CH 55V 110A D2PAK

label:
2024/03/18 252



CATALOG
IRF3205STRLPBF COUNTRY OF ORIGIN
IRF3205STRLPBF PARAMETRIC INFO
IRF3205STRLPBF PACKAGE INFO
IRF3205STRLPBF MANUFACTURING INFO
IRF3205STRLPBF PACKAGING INFO
IRF3205STRLPBF EACD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)
China
United States of America
Korea (Republic of)


PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Single
Maximum Drain Source Voltage (V) 55
Material Si
Maximum Continuous Drain Current (A) 110
Maximum Absolute Continuous Drain Current (A) 110
Maximum Gate Source Voltage (V) ±20
Maximum Drain Source Resistance (mOhm) 8@10V
Typical Gate Charge @ Vgs (nC) 146(Max)@10V
Typical Gate Charge @ 10V (nC) 146(Max)
Maximum Power Dissipation (mW) 200000
Process Technology HEXFET
Category Power MOSFET
Typical Gate to Drain Charge (nC) 36
Typical Input Capacity @ Vds (pF) 3247@25V
Typical Turn-On Delay Time (ns) 14
Typical Turn-Off Delay Time (ns) 50
Typical Fall Time (ns) 65
Typical Rise Time (ns) 101
Maximum Gate Threshold Voltage (V) 4
Number of Elements per Chip 1
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 175


PACKAGE INFO
Supplier packaging D2PAK
Basic package type Lead-Frame SMT
Number of pins 3
Pin shape Gull-wing
PCB 2
ears ears
Pin spacing (mm) 2.54
Package length (mm) 10.67(Max)
Package width (mm) 9.65(Max)
Package height (mm) 4.83(Max)
Package diameter (mm) N/R
Package Overall Length (mm) 10.67(Max)
Package Overall Width (mm) 15.88(Max)
Package Overall Height (mm) 5.08(Max)
Mounting surface height (mm) 5.08(Max)
Install Surface Mount
Package weight (g) not applicable
Packaging materials Plastic
package instruction Double Deca Watt Package
Package series name TO-263
JEDEC TO-263AB
Package outline Link to datasheet


MANUFACTURING INFO
MSL 1
Maximum reflow temperature (°C) 260
Reflow soldering time (seconds) 10 to 30
Reflow temperature source Link to datasheet
Maximum wave soldering temperature (°C) 300
Wave soldering time (seconds) 10
Wave soldering temperature source Link to datasheet
Lead Finish(Plating) Matte Sn annealed
Plating materials Ni
Terminal Base Material Cu Alloy
Shelf Life Period 3 Years


PACKAGING INFO
Packaging Suffix TRL
Package Tape and reel packaging
Packing quantity 800


ECAD MODELS

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