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• Advanced Process Technology
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• Ultra Low On-Resistance
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• 175°C Operating Temperature
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• Fast Switching
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• Repetitive Avalanche Allowed up to Tjmax
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| • Lead-Free
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| CATALOG |
IRF3205ZLPbF COUNTRY OF ORIGIN
|
| IRF3205ZLPBF LIFECYCLE |
IRF3205ZLPbF PARAMETRIC INFO
|
IRF3205ZLPbF PACKAGE INFO
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IRF3205ZLPbF MANUFACTURING INFO
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IRF3205ZLPbF PACKAGING INFO
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COUNTRY OF ORIGIN
|
Taiwan (Province of China)
|
| Mexico |
| United Kingdom of Great Britain and Northern Ireland |
| China |
|
| LIFECYCLE |
Obsolete
Dec 31,2023 |
|
PARAMETRIC INFO
|
| Channel Type |
N |
| Channel Mode |
Enhancement |
| Configuration |
Single |
| Maximum Drain Source Voltage (V) |
55 |
| Material |
Si |
| Maximum Continuous Drain Current (A) |
110 |
| Maximum Absolute Continuous Drain Current (A) |
110 |
| Maximum Gate Source Voltage (V) |
±20 |
| Maximum Drain Source Resistance (mOhm) |
6.5@10V |
| Typical Gate Charge @ Vgs (nC) |
76@10V |
| Typical Gate Charge @ 10V (nC) |
76 |
| Maximum Power Dissipation (mW) |
170000 |
| Process Technology |
HEXFET |
| Category |
Power MOSFET |
| Typical Input Capacitance @ Vds (pF) |
3450@25V |
| Typical Turn-On Delay Time (ns) |
18 |
| Typical Turn-Off Delay Time (ns) |
45 |
| Typical Fall Time (ns) |
67 |
| Typical Rise Time (ns) |
95 |
| Maximum Gate Threshold Voltage (V) |
4 |
| Number of Elements per Chip |
1 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
175 |
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|
PACKAGE INFO
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| Supplier Package |
TO-262 |
| Basic Package Type |
Through Hole |
| Pin Count |
3 |
| Lead Shape |
Through Hole |
| PCB |
3 |
| Tab |
Tab |
| Pin Pitch (mm) |
2.54 |
| Package Length (mm) |
10.67(Max) |
| Package Width (mm) |
4.83(Max) |
| Package Height (mm) |
9.65(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
15.01(Max) |
| Mounting |
Through Hole |
| Package Material |
Plastic |
| Package Description |
Transistor Outline Package |
| Package Family Name |
TO |
| Jedec |
TO-262AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
N/R |
| Reflow Solder Time (Sec) |
N/R |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
300 |
| Wave Solder Time (Sec) |
10 |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
N/A |
| Under Plating Material |
N/A |
| Terminal Base Material |
N/A |
| Shelf Life Period |
3 Years |
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|
PACKAGING INFO
|
| Packaging |
Tube |
| Quantity Of Packaging |
1000 |
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