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| CATALOG |
| IRFR3806TRPBF COUNTRY OF ORIGIN |
IRFR3806TRPBF PARAMETRIC INFO
|
IRFR3806TRPBF PACKAGE INFO
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IRFR3806TRPBF MANUFACTURING INFO
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IRFR3806TRPBF PACKAGING INFO
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| AD8622ARZ-REEL7 APPLICATIONS |
|
| COUNTRY OF ORIGIN |
| Taiwan (Province of China) |
| China |
| Mexico |
| Germany |
| United Kingdom of Great Britain and Northern Ireland |
|
PARAMETRIC INFO
|
| Channel Type |
N |
| Channel Mode |
Enhancement |
| Configuration |
Single |
| Maximum Drain Source Voltage (V) |
60 |
| Maximum Continuous Drain Current (A) |
43 |
| Maximum Absolute Continuous Drain Current (A) |
43 |
| Maximum Gate Source Voltage (V) |
±20 |
| Maximum Drain Source Resistance (mOhm) |
15.8@10V |
| Typical Gate Charge @ Vgs (nC) |
22@10V |
| Typical Gate Charge @ 10V (nC) |
22 |
| Maximum Power Dissipation (mW) |
71000 |
| Process Technology |
HEXFET |
| Category |
Power MOSFET |
| Typical Input Capacitance @ Vds (pF) |
1150@50V |
| Typical Turn-On Delay Time (ns) |
6.3 |
| Typical Turn-Off Delay Time (ns) |
49 |
| Typical Fall Time (ns) |
47 |
| Typical Rise Time (ns) |
40 |
| Maximum Gate Threshold Voltage (V) |
4 |
| Number of Elements per Chip |
1 |
| Minimum Operating Temperature (°C) |
-55 |
| Maximum Operating Temperature (°C) |
175 |
|
|
PACKAGE INFO
|
| Supplier Package |
DPAK |
| Pin Count |
3 |
| PCB |
2 |
| Tab |
Tab |
| Pin Pitch (mm) |
2.29 |
| Package Length (mm) |
6.73(Max) |
| Package Width (mm) |
6.22(Max) |
| Package Height (mm) |
2.39(Max) |
| Package Diameter (mm) |
N/R |
| Seated Plane Height (mm) |
2.52(Max) |
| Mounting |
Surface Mount |
| Package Material |
Plastic |
| Package Description |
Deca Watt Package |
| Package Family Name |
TO-252 |
| Jedec |
TO-252AA |
| Package Outline |
Link to Datasheet |
|
|
MANUFACTURING INFO
|
| MSL |
1 |
| Maximum Reflow Temperature (°C) |
260 |
| Reflow Solder Time (Sec) |
10 to 30 |
| Reflow Temp. Source |
Link to Datasheet |
| Maximum Wave Temperature (°C) |
300 |
| Wave Solder Time (Sec) |
N/A |
| Wave Temp. Source |
Link to Datasheet |
| Lead Finish(Plating) |
Matte Sn annealed|Matte Sn |
| Under Plating Material |
N/A|Ni |
| Terminal Base Material |
Cu |
| Shelf Life Period |
3 Years |
|
|
PACKAGING INFO
|
| Packaging Suffix |
TR |
| Packaging |
Tape and Reel |
| Quantity Of Packaging |
2000 |
|
|
| APPLICATIONS |
| • High Efficiency Synchronous Rectification in SMPS
|
| • Uninterruptible Power Supply |
| • High Speed Power Switching |
• Hard Switched and High Frequency Circuits
|
| |
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