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CATALOG |
IRFS7440TRLPBF COUNTRY OF ORIGIN |
IRFS7440TRLPBF PARAMETRIC INFO |
IRFS7440TRLPBF PACKAGE INFO |
IRFS7440TRLPBF MANUFACTURING INFO |
IRFS7440TRLPBF PACKAGING INFO |
IRFS7440TRLPBF ECAD MODELS |
IRFS7440TRLPBF APPLICATIONS |
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COUNTRY OF ORIGIN |
China |
Israel |
Mexico |
Taiwan (Province of China) |
United Kingdom of Great Britain and Northern Ireland |
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PARAMETRIC INFO |
Channel Type |
N |
Channel Mode |
Enhancement |
Configuration |
Single |
Maximum Drain Source Voltage (V) |
40 |
Maximum Continuous Drain Current (A) |
208 |
Maximum Gate Source Voltage (V) |
±20 |
Maximum Drain Source Resistance (mOhm) |
2.5@10V |
Typical Gate Charge @ Vgs (nC) |
90@10V |
Typical Gate Charge @ 10V (nC) |
90 |
Maximum Power Dissipation (mW) |
208000 |
Process Technology |
HEXFET |
Category |
Power MOSFET |
Typical Input Capacitance @ Vds (pF) |
4730@25V |
Typical Turn-On Delay Time (ns) |
24 |
Typical Turn-Off Delay Time (ns) |
115 |
Typical Fall Time (ns) |
68 |
Typical Rise Time (ns) |
68 |
Maximum Gate Source Leakage Current (nA) |
100 |
Maximum Gate Threshold Voltage (V) |
3.9 |
Maximum IDSS (uA) |
1 |
Number of Elements per Chip |
1 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
175 |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
175 |
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PACKAGE INFO |
Supplier Package |
D2PAK |
Basic Package Type |
Lead-Frame SMT |
Pin Count |
3 |
Lead Shape |
Gull-wing |
PCB |
2 |
Tab |
Tab |
Pin Pitch (mm) |
2.54 |
Package Length (mm) |
10.67(Max) |
Package Width (mm) |
9.65(Max) |
Package Height (mm) |
4.83(Max) |
Package Diameter (mm) |
N/R |
Package Overall Length (mm) |
10.67(Max) |
Package Overall Width (mm) |
15.88(Max) |
Package Overall Height (mm) |
5.08(Max) |
Seated Plane Height (mm) |
5.08(Max) |
Mounting |
Surface Mount |
Package Material |
Plastic |
Package Description |
Double Deca Watt Package |
Package Family Name |
TO-263 |
Jedec |
TO-263AB |
Package Outline |
Link to Datasheet |
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MANUFACTURING INFO |
MSL |
1 |
Maximum Reflow Temperature (°C) |
245 |
Reflow Solder Time (Sec) |
30 |
Number of Reflow Cycle |
3 |
Standard |
J-STD-020D |
Reflow Temp. Source |
Link to Datasheet |
Maximum Wave Temperature (°C) |
300 |
Wave Solder Time (Sec) |
10 |
Wave Temp. Source |
Link to Datasheet |
Lead Finish(Plating) |
Matte Sn |
Under Plating Material |
N/A|Ni |
Terminal Base Material |
Cu |
Shelf Life Period |
3 Years |
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PACKAGING INFO |
Packaging Suffix |
TR |
Packaging |
Tape and Reel |
Quantity Of Packaging |
800 |
Packaging Document |
Link to Datasheet |
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ECAD MODELS |
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APPLICATIONS |
• Brushed Motor drive applications
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• BLDC Motor drive applications |
• Battery powered circuits
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• Half-bridge and full-bridge topologies |
• Synchronous rectifier applications
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• Resonant mode power supplies |
• OR-ing and redundant power switches |
• DC/DC and AC/DC converters |
• DC/AC Inverters |
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