IRFS7440TRLPBF Infineon Technologies MOSFET N CH 40V 120A D2PAK

label:
2023/09/14 416


CATALOG
IRFS7440TRLPBF COUNTRY OF ORIGIN
IRFS7440TRLPBF PARAMETRIC INFO
IRFS7440TRLPBF PACKAGE INFO
IRFS7440TRLPBF MANUFACTURING INFO
IRFS7440TRLPBF PACKAGING INFO
IRFS7440TRLPBF ECAD MODELS
IRFS7440TRLPBF APPLICATIONS


COUNTRY OF ORIGIN
China
Israel
Mexico
Taiwan (Province of China)
United Kingdom of Great Britain and Northern Ireland


PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Single
Maximum Drain Source Voltage (V) 40
Maximum Continuous Drain Current (A) 208
Maximum Gate Source Voltage (V) ±20
Maximum Drain Source Resistance (mOhm) 2.5@10V
Typical Gate Charge @ Vgs (nC) 90@10V
Typical Gate Charge @ 10V (nC) 90
Maximum Power Dissipation (mW) 208000
Process Technology HEXFET
Category Power MOSFET
Typical Input Capacitance @ Vds (pF) 4730@25V
Typical Turn-On Delay Time (ns) 24
Typical Turn-Off Delay Time (ns) 115
Typical Fall Time (ns) 68
Typical Rise Time (ns) 68
Maximum Gate Source Leakage Current (nA) 100
Maximum Gate Threshold Voltage (V) 3.9
Maximum IDSS (uA) 1
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 175
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 175
 

PACKAGE INFO
Supplier Package D2PAK
Basic Package Type Lead-Frame SMT
Pin Count 3
Lead Shape Gull-wing
PCB 2
Tab Tab
Pin Pitch (mm) 2.54
Package Length (mm) 10.67(Max)
Package Width (mm) 9.65(Max)
Package Height (mm) 4.83(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 10.67(Max)
Package Overall Width (mm) 15.88(Max)
Package Overall Height (mm) 5.08(Max)
Seated Plane Height (mm) 5.08(Max)
Mounting Surface Mount
Package Material Plastic
Package Description Double Deca Watt Package
Package Family Name TO-263
Jedec TO-263AB
Package Outline Link to Datasheet
 

MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 245
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) 300
Wave Solder Time (Sec) 10
Wave Temp. Source Link to Datasheet
Lead Finish(Plating) Matte Sn
Under Plating Material N/A|Ni
Terminal Base Material Cu
Shelf Life Period 3 Years
 

PACKAGING INFO
Packaging Suffix TR
Packaging Tape and Reel
Quantity Of Packaging 800
Packaging Document Link to Datasheet
 

ECAD MODELS


APPLICATIONS
• Brushed Motor drive applications  
• BLDC Motor drive applications
• Battery powered circuits  
• Half-bridge and full-bridge topologies
• Synchronous rectifier applications  
• Resonant mode power supplies
• OR-ing and redundant power switches
• DC/DC and AC/DC converters
• DC/AC Inverters


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