Channel Type |
N |
Channel Mode |
Enhancement |
Configuration |
Single Quint Source |
Maximum Drain Source Voltage (V) |
60 |
Material |
Si |
Maximum Continuous Drain Current (A) |
338 |
Maximum Absolute Continuous Drain Current (A) |
338 |
Maximum Gate Source Voltage (V) |
±20 |
Maximum Drain Source Resistance (mOhm) |
1.4@10V |
Typical Gate Charge @ Vgs (nC) |
236@10V |
Typical Gate Charge @ 10V (nC) |
236 |
Maximum Power Dissipation (mW) |
375000 |
Process Technology |
HEXFET |
Category |
Power MOSFET |
Maximum Junction Case Thermal Resistance |
0.4K/W |
Typical Input Capacitance @ Vds (pF) |
12960@25V |
Typical Turn-On Delay Time (ns) |
24 |
Typical Turn-Off Delay Time (ns) |
168 |
Typical Fall Time (ns) |
79 |
Typical Rise Time (ns) |
102 |
Maximum Gate Source Leakage Current (nA) |
100 |
Maximum Gate Threshold Voltage (V) |
3.7 |
Maximum IDSS (uA) |
1 |
Number of Elements per Chip |
1 |
Minimum Storage Temperature (°C) |
-55 |
Maximum Storage Temperature (°C) |
175 |
Minimum Operating Temperature (°C) |
-55 |
Maximum Operating Temperature (°C) |
175 |