IRFS7530TRL7PP Infineon Technologies MOSFET N CH 60V 240A D2PAK

label:
2024/01/15 293



CATALOG
IRFS7530TRL7PP COUNTRY OF ORIGIN
IRFS7530TRL7PP PARAMETRIC INFO
IRFS7530TRL7PP PACKAGE INFO
IRFS7530TRL7PP MANUFACTURING INFO
IRFS7530TRL7PP PACKAGING INFO
IRFS7530TRL7PP ECAD MODELS
IRFS7530TRL7PP APPLICATIONS


COUNTRY OF ORIGIN
Mexico
Germany
China
Israel


PARAMETRIC INFO
Channel Type N
Channel Mode Enhancement
Configuration Single Quint Source
Maximum Drain Source Voltage (V) 60
Material Si
Maximum Continuous Drain Current (A) 338
Maximum Absolute Continuous Drain Current (A) 338
Maximum Gate Source Voltage (V) ±20
Maximum Drain Source Resistance (mOhm) 1.4@10V
Typical Gate Charge @ Vgs (nC) 236@10V
Typical Gate Charge @ 10V (nC) 236
Maximum Power Dissipation (mW) 375000
Process Technology HEXFET
Category Power MOSFET
Maximum Junction Case Thermal Resistance 0.4K/W
Typical Input Capacitance @ Vds (pF) 12960@25V
Typical Turn-On Delay Time (ns) 24
Typical Turn-Off Delay Time (ns) 168
Typical Fall Time (ns) 79
Typical Rise Time (ns) 102
Maximum Gate Source Leakage Current (nA) 100
Maximum Gate Threshold Voltage (V) 3.7
Maximum IDSS (uA) 1
Number of Elements per Chip 1
Minimum Storage Temperature (°C) -55
Maximum Storage Temperature (°C) 175
Minimum Operating Temperature (°C) -55
Maximum Operating Temperature (°C) 175


PACKAGE INFO
Supplier Package D2PAK
Pin Count 7
PCB 6
Tab Tab
Pin Pitch (mm) 1.27
Package Length (mm) 10.67(Max)
Package Width (mm) 9.65(Max)
Package Height (mm) 4.83(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 10.67(Max)
Package Overall Width (mm) 15.88(Max)
Package Overall Height (mm) 5.08(Max)
Seated Plane Height (mm) 5.08(Max)
Mounting Surface Mount
Package Material Plastic
Package Family Name TO-263
Jedec TO-263CB
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 245
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material Ni
Terminal Base Material Cu Alloy
Shelf Life Period 3 Years


PACKAGING INFO
Packaging Suffix TRL
Packaging Tape and Reel
Quantity Of Packaging 800


ECAD MODELS



APPLICATIONS
• Brushed Motor drive applications
• BLDC Motor drive applications
• Battery powered circuits
• Half-bridge and full-bridge topologies
• Synchronous rectifier applications
• Resonant mode power supplies
• OR-ing and redundant power switches
Продукт RFQ