IRLHS6376TRPBF Infineon Technologies MOSFET 2N-CH 30V 3.6A PQFN

label:
2024/09/12 167
IRLHS6376TRPBF Infineon Technologies MOSFET 2N-CH 30V 3.6A PQFN


CATALOG
IRLHS6376TRPBF COUNTRY OF ORIGIN
IRLHS6376TRPBF PARAMETRIC INFO
IRLHS6376TRPBF PACKAGE INFO
IRLHS6376TRPBF MANUFACTURING INFO
IRLHS6376TRPBF PACKAGING INFO
IRLHS6376TRPBF ECAD MODELS


COUNTRY OF ORIGIN
Taiwan (Province of China)
China
United Kingdom of Great Britain and Northern Ireland
Thailand


PARAMETRIC INFO
Manufacturer Type Low Noise Amplifier
Number of Channels per Chip 1
Typical Power Gain (dB) 20@12000MHz
Typical Noise Figure (dB) 2.1@12000MHz
Typical Output 1dB Compressed Power @ Bias Conditions (dBm) 14
Typical 3rd Order Output Intercept Point @ Bias Conditions (dBm) 26
Typical Output Intercept Point (dBm) 26@12000MHz
Minimum Operating Frequency (MHz) 8000
Maximum Operating Frequency (MHz) 12000
Typical Output Power (dBm) 14@12000MHz
Typical Output Power Range (dBm) 10 to 15
Maximum Input Return Loss (dB) 10(Typ)@12000MHz
Maximum Output Return Loss (dB) 13(Typ)@12000MHz
Power Supply Type Single
Typical Single Supply Voltage (V) 4
Maximum Single Supply Voltage (V) 6
Maximum Operating Supply Voltage (V) 6
Maximum Supply Current (mA) 75@4V
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package QFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 16
Lead Shape No Lead
PCB 16
Tab N/R
Pin Pitch (mm) 0.5
Package Length (mm) 3
Package Width (mm) 3
Package Height (mm) 0.95(Max)
Package Diameter (mm) N/R
Package Overall Length (mm) 3
Package Overall Width (mm) 3
Package Overall Height (mm) 0.9
Seated Plane Height (mm) 0.9
Mounting Surface Mount
Package Weight (g) N/A
Package Material Plastic
Package Description Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Jedec MO-220VEED-6
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL 1
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 30
Number of Reflow Cycle 3
Standard J-STD-020D
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn
Under Plating Material Cu
Terminal Base Material N/A
Number of Wave Cycles N/R

 
PACKAGING INFO
Packaging Tape and Reel
Quantity Of Packaging 500
Packaging Document Link to Datasheet


ECAD MODELS
Продукт RFQ